What are the methods for destructive testing of components?

Date：2023-05-12 15:07:05 Views：617

Destructive testing of components refers to the heating, cutting, peeling, and other processing of the tested electronic components. It detects the performance and quality of the components by damaging them to detect structural defects and stability of their performance. It can help engineers identify potential defects and technical issues in electronic devices to ensure product quality and reliability. Below, this article will introduce several common destructive testing methods for components.

Cutting method: This is the most common destructive testing method for components, which typically exposes the internal structure of the component by cutting it to detect welding defects, copper wire breakage, or corrosion of circuit traces.

Stripping method: This method involves immersing components in chemical reagents or corresponding etchants to remove the signal coverage layer of circuit traces. It can also be used to detect issues such as loose metal wires or short circuits in solder balls in semiconductor devices.

Pressure high-temperature method: This method involves applying high temperature and high pressure to electronic devices to produce some significant physical changes. This can be used to detect issues such as welding, copper wire breakage, and wafer bending.

Microscopic method: This method uses a microscope to examine the surface and internal structure of electronic devices to determine defects or errors. This method is commonly used for optical applications, carbon fiber magnifying electronic mirrors, and so on.

Analysis method: This method uses a series of complex techniques, such as electron probes, micro X-ray, scanning electron microscopy, etc., to determine the content and distribution of various chemical elements in components, the structure of silicon substrates, and doping treatment.

It should be noted that destructive testing of components requires strict adherence to relevant regulations and standards to ensure the accuracy and safety of the testing results. At the same time, when conducting destructive testing of components, appropriate equipment and tools should be selected to ensure the safety of the testing process. Each method has its scope of application and specific applications. To determine which method to use, it is necessary to choose the most suitable testing method based on the type of device to be tested and the purpose of the test.

The above is the content related to destructive testing of components organized by Chuangxin Testing, hoping to be helpful to you. Our company has a team of professional engineers and industry elites, with three standardized laboratories covering an area of over 1800 square meters. We can undertake various testing projects such as electronic component testing and verification, IC authenticity identification, product design and material selection, failure analysis, functional testing, factory incoming material inspection, and tape weaving.