Characteristics of destructive and non-destructive testing of electronic components
Date:2023-05-12 15:07:14 Views:1536
It should be noted that damage to electronic components is inevitable, especially after prolonged use. In order to detect and repair damaged electronic components in a timely manner, destructive testing and non-destructive testing methods are required. These two testing methods have different characteristics and need to be selected and applied according to specific situations. This article will introduce the characteristics of these two detection methods.
1、 Destructive testing
Destructive testing refers to the process of dismantling or damaging electronic components to detect their damage. The advantages of this method are fast, simple, and inexpensive, which can quickly identify damaged components for repair or replacement. However, the disadvantage of this method is that destructive detection can damage the components, leading to their loss of useful value, especially for expensive electronic components, which can be a significant loss.
Destructive testing typically includes the following methods:
Bridge detection: Short circuit two pins of an electronic component and measure its resistance using a bridge. If the resistance value is incorrect, it indicates that the component has been damaged. This method can quickly detect whether the component is damaged, but requires a large amount of current, so careful operation is necessary to avoid causing damage to the component.
Thread cutting detection: Cut off the pins of electronic components and measure their resistance value. If the resistance value is infinite, it indicates that the component has been damaged. This method also requires careful operation to avoid damage to the components.
Thermistor detection: Short circuit the pins of electronic components and measure their thermistor values. If the thermistor value is incorrect, it indicates that the component has been damaged. This method can quickly detect whether the component is damaged, but requires a large amount of current, so careful operation is necessary to avoid causing damage to the component.
2、 Non destructive testing
Non destructive testing refers to detecting the electrical characteristics and behavior of electronic components to determine whether they are damaged without damage. The advantage of this method is that it can avoid damage to the components, thereby improving the service life of the components. However, this method typically requires higher technology and cost, and may require more time to complete.
Non destructive testing typically includes the following methods:
Multimeter detection: Using a multimeter can detect the electrical characteristics and behavior of electronic components. For example, a multimeter can be used to detect resistance values, voltage values, and current values. This method can quickly detect whether the component is damaged, but requires high technical capabilities.
Oscilloscope detection: Using an oscilloscope can detect the electrical characteristics and behavior of electronic components. For example, an oscilloscope can be used to detect voltage waveforms, frequencies, and amplitudes. This method can quickly detect whether the component is damaged, but requires high technical capabilities.
It should be noted that although non-destructive testing can avoid the disadvantage of damaging the tested components compared with destructive testing of electronic components, due to the quality limitation of Device under test, the accuracy and detail of defects detected are not as good as those provided by destructive testing.
To summarize, both destructive and non-destructive testing of electronic components are two necessary testing methods in the electronic component industry. They all have their own characteristics and applicability, and need to be selected in specific applications. Chuangxin Testing is a professional testing institution for electronic components. Currently, it mainly provides integrated circuit testing services such as capacitors, resistors, connectors, MCU, CPLD, FPGA, DSP, etc. Specializing in functional testing of electronic components, appearance testing of incoming electronic components, anatomical testing of electronic components, acetone testing, X-ray scanning testing of electronic components, and ROHS composition analysis testing. Welcome to call, we will be happy to serve you!