Common semiconductor device screening projects

The reliability and performance stability of semiconductor devices are key to the success of electronic products. Due to the wide variety of semiconductor devices and the existence of various products in the market, a series of screening is required when purchasing. This article will introduce the main screening items of semiconductor devices, helping readers better understand how to choose semiconductor devices that are suitable for their needs. Whether considering performance indicators, reliability, cost, or supply chain, the correct screening method can ensure that we choose the most suitable semiconductor devices to meet our practical application needs.

Testability screening mainly focuses on the key performance of devices, including electrical and mechanical properties. By testing the device performance before and after screening, it is possible to evaluate whether the device can withstand subsequent use or further processing. This screening project can effectively eliminate devices with unsatisfactory performance or insufficient stability. Inspection screening involves a detailed examination of the appearance and internal structure of semiconductor devices, mainly including microscopic examination X-ray inspection, sealing inspection, and particle collision noise detection (PIND), etc.

Microscopic examination: used to detect defects in the chip itself or during assembly, wire bonding, and other processes.

X-ray examination: examine the interior of the device to identify serious defects such as broken leads and chip skewness.

Sealing inspection: Ensure that the protective gas inside the device does not leak and that harmful external atmospheres do not invade, which is particularly important for devices that have been working or stored for a long time.

Particle collision noise detection (PIND): mainly used for aerospace grade devices to detect whether there are movable residues inside and prevent possible internal short circuits and other problems. Environmental stress screening tests the stability and reliability of analog devices through various extreme environmental conditions that may be encountered in practical use. This includes constant acceleration screening and temperature cycling screening.

Constant acceleration screening: detects the structural stability of the device through the centrifugal force generated by high-speed rotation.

Temperature cycle screening: Simulate the working environment of the device under rapidly changing temperature conditions, detect issues such as material mismatch or chip cracks. Life screening aims to evaluate the long-term stability of devices through accelerated aging testing, including high-temperature storage screening and power aging screening.

High temperature storage screening: Store devices at high temperatures to test their stability in long-term high-temperature environments.

Power aging screening: By aging the device by powering it up at high temperatures, simulating long-term working conditions, possible faulty devices can be detected and eliminated early on.

Through the comprehensive application of the above screening projects, the reliability and performance stability of semiconductor devices can be greatly improved, providing a solid foundation for the high-quality operation of electronic products. These screening processes are not only crucial for ensuring the reliability of modern electronic equipment, but also a crucial step in improving the quality level of products in the entire electronics industry.

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