Introduction to component detection methods and main steps of failure analysis

Date：2021-09-08 15:40:00 Views：2159

Generally, the failures of electronic components are called failure. Knowing the failure mode and mechanism of components and the mechanism of equipment failure is very important for diagnosing equipment failure and maintaining the inherent reliability of equipment. The purpose of component failure analysis is not only to judge the failure nature and clarify the failure cause, but also to find an effective way to actively prevent repeated failure. Let's take a look at the main steps of component detection methods and failure analysis.

Main steps of failure analysis:

Chip opening / capping: remove the IC sealing glue, keep the chip function intact, and keep die, bond pads, bond wires and even lead frame from damage, so as to prepare for the next chip failure analysis experiment.

SEM / SEM / EDX composition analysis: including material structure analysis / defect observation, conventional micro area analysis of element composition, accurate measurement of component size, etc.

Probe test: quickly and conveniently obtain the internal electrical signal of IC with microprobe.

Laser cutting: cutting a line or a specific area on the upper layer of a chip with a micro laser beam.

Emmi detection: Emmi low light level microscope is a highly efficient failure analysis tool, which provides a highly sensitive and non-destructive fault location method. It can detect and locate very weak luminescence (visible light and near-infrared light), so as to capture the visible light of leakage current caused by various component defects or abnormalities.

OBIRCH application (laser beam induced impedance value change test): OBIRCH is commonly used for high impedance and low impedance analysis inside the chip and line leakage path analysis. Using OBIRCH method, defects in the circuit can be located effectively, such as holes in lines and holes under through holes. The high resistance area at the bottom of the through hole can also effectively detect short circuit or leakage, which is a powerful supplement to the luminescence microscopy technology. LG liquid crystal hot spot detection: the liquid crystal is used to sense the molecular arrangement and reorganization at the IC leakage, showing a mottled image different from other areas under the microscope, so as to find the leakage area (fault point exceeding 10mA) that puzzles the designer in the actual analysis.

Fixed point / non fixed point chip grinding: remove the gold bump planted on the LCD driver chip pad and keep the pad intact for subsequent analysis or rebinding.

X-ray nondestructive detection: detect various defects in IC package, such as layer peeling, burst, cavity and wire integrity, possible defects in PCB process, such as poor alignment or bridging, open circuit, short circuit or abnormal connection, and tin ball integrity in package.

Sam (SAT) ultrasonic flaw detection: it can carry out non-destructive detection on the internal structure of IC package and effectively detect various damages caused by water, gas or heat, such as: Wafer surface delamination Cracks in solder balls, wafers, or fillers Air holes inside the packaging material Various holes, such as holes at wafer joint surface, tin ball, glue filling, etc.

Component detection method:

1. C-sam (ultrasonic scanning microscope), NDT: 1 Lattice structure, impurity particles, inclusions and precipitates in materials. 2 Internal cracks 3. Delamination defect. 4 Voids, bubbles, voids, etc.

2. X-ray (these two are the first non-destructive analysis methods used after chip failure)

Application of micro focus Xray: analysis of internal displacement of semiconductor BGA and circuit board; It is helpful to distinguish BGA welding defects such as empty welding and false welding Parameters: standard detection resolution < 500 nm; Geometric magnification: 2000 times, maximum magnification: 10000 times; Low radiation: less than 1 per hour μ Sv ； Voltage: 160 kV, open ray tube design.Anti collision design; BGA and SMT (QFP) automatic analysis software, void calculation software, general defect automatic identification software and video recording. These characteristics are very suitable for all kinds of two-dimensional detection and three-dimensional micro focus computed tomography（ μ CT) application.

3. SEM scanning electron microscope / EDX energy dispersive X-ray (material structure analysis / defect observation, element composition, conventional micro area analysis, accurate measurement of component size)

4. Emmi low light level microscope / OBIRCH laser beam induced impedance value change test / LC liquid crystal hot spot detection (these three belong to common leakage current path analysis methods. To find the hot spot, LC needs the help of probe table and oscilloscope)

5. FIB line modification, tangent line, tangent point observation, TEM sample preparation, precision thickness measurement, etc

6. Probe station / probe test probe test, ESD / latch up electrostatic discharge / latch up utility test (some customers conduct these two reliability tests before the chip flows into the client, and some customers think of screening good chips for inspection after failure). These have mentioned most common methods. There are some necessary sample processing procedures before failure analysis.

7. Take die and decap, grind, remove golden ball, de gold bump, remove layer, dye, etc. some also need corresponding instruments and machines. SEM can view die surface, Sam and X-ray to observe the internal condition of package and delamination failure.

In addition to the common methods, there are other failure analysis methods, such as atomic force microscope AFM, secondary ion mass spectrometry Sims, time of flight mass spectrometry TOF-SIMS, transmission electron microscope TEM, field emission electron microscope, field emission scanning auger probe, X-ray photoelectron spectroscopy XPS, l-i-v test system, energy loss X-ray microanalysis system and many other methods, but these items are not very commonly used.

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