Super complete summary of failure analysis methods for different types of materials

Date：2021-09-09 13:16:00 Views：1577

Basic concepts of failure analysis

Definition: the process of diagnosing failed electronic components.

1. Failure analysis often requires electrical measurement and advanced physical, metallurgical and chemical analysis methods.

2. The purpose of failure analysis is to determine the failure mode and failure mechanism, and put forward corrective measures to prevent the recurrence of this failure mode and failure mechanism.

3. Failure mode refers to the observed failure phenomena and failure forms, such as open circuit, short circuit, parameter drift, function failure, etc.

4. Failure mechanism refers to the physical and chemical processes of failure, such as fatigue, corrosion and overstress.

Failure analysis and detection methods for different types of materials:

1. PCB / PCBA failure analysis

As the carrier of various components and the hub of circuit signal transmission, PCB has become the most important and key part of electronic information products. Its quality and reliability level determine the quality and reliability of the whole equipment.

failure mode

Plate explosion, delamination, short circuit, blistering, poor welding, corrosion migration, etc.

Common means

NDT:

Appearance inspection, X-ray fluoroscopy, three-dimensional CT, C-sam, infrared thermal imaging

Surface element analysis:

Scanning electron microscope and energy spectrum analysis (SEM / EDS)

Micro infrared analysis (FTIR)

Auger electron spectroscopy (AES)

X-ray photoelectron spectroscopy (XPS)

Secondary ion mass spectrometry (TOF-SIMS)

Thermal analysis:

Differential scanning calorimetry (DSC)

Thermomechanical analysis (TMA)

Thermogravimetric analysis (TGA)

Dynamic thermomechanical analysis (DMA)

Thermal conductivity (steady state heat flow method, laser scattering method)

Electrical performance test：

Breakdown voltage, withstand voltage, dielectric constant, electromigration

Destructive performance test:

Dyeing and penetrant testing

2. Failure analysis of electronic components

The rapid development of electronic component technology and the improvement of reliability have laid the foundation of modern electronic equipment. The fundamental task of component reliability is to improve the reliability of components.

failure mode

Open circuit, short circuit, leakage, function failure, electrical parameter drift, unstable failure, etc

Common means

Electrical test: connectivity test, electrical parameter test, function test

NDT:

Unsealing Technology (mechanical unsealing, chemical unsealing, laser unsealing)

De passivation layer technology (chemical corrosion de passivation layer, plasma corrosion de passivation layer, mechanical grinding de passivation layer)

Micro area analysis technology (FIB, CP)

Sample preparation technology:

Unsealing Technology (mechanical unsealing, chemical unsealing, laser unsealing)

De passivation layer technology (chemical corrosion de passivation layer, plasma corrosion de passivation layer, mechanical grinding de passivation layer)

Micro area analysis technology (FIB, CP)

Micro morphology analysis:

Optical microanalysis Technology

Scanning electron microscope secondary electron image technology

Surface element analysis:

Scanning electron microscope and energy spectrum analysis (SEM / EDS)

Auger electron spectroscopy (AES)

X-ray photoelectron spectroscopy (XPS)

Secondary ion mass spectrometry (SIMS)

Nondestructive analysis technology:

X-ray fluoroscopy Technology

3D perspective technology

Reflective scanning acoustic microscopy (C-sam)

3. Failure analysis of metal materials

With the progress of society and the development of science and technology, metal products are more and more widely used in industry, agriculture, science and technology and people's life. Therefore, the quality of metal materials should be paid more attention.

Marine diesel engine crankshaft gear

failure mode

Improper design, material defect, casting defect, welding defect, heat treatment defect

Common means

Microstructure analysis of metal materials:

Metallographic analysis

X-ray phase structure analysis

Surface residual stress analysis

Grain size of metal materials

Composition analysis:Direct reading spectrometer, X-ray photoelectron spectrometer (XPS), Auger electron spectrometer (AES), etc

Phase analysis:X-ray diffractometer (XRD)

Residual stress analysis:X-ray stress tester

Mechanical property analysis:Universal testing machine, impact testing machine, hardness testing machine, etc

SEM image of fracture surface of tensile test material

4. Failure analysis of polymer materials

The general development trend of polymer material technology is high performance, high function, compound, intelligent and green. Because of the new requirements of technology and the high requirements of products, it is necessary to find out the root cause and mechanism of failure by means of failure analysis, so as to improve product quality, process improvement and responsibility arbitration.

failure mode

Fracture, cracking, delamination, corrosion, blistering, coating falling off, discoloration, wear failure

Common means

Composition analysis:

Fourier infrared spectrometer (FTIR)

Micro confocal Raman spectrometer (Raman)

Scanning electron microscope and energy spectrum analysis (SEM / EDS)

X-ray fluorescence spectrometry (XRF)

Gas chromatography-mass spectrometry (GC-MS)

Pyrolysis gas chromatography-mass spectrometry (PGC-MS)

Nuclear magnetic resonance analysis (NMR)

Auger electron spectroscopy (AES)

X-ray photoelectron spectroscopy (XPS)

X-ray diffractometer (XRD)

Time of flight secondary ion mass spectrometry (TOF-SIMS)

Thermal analysis:

Differential scanning calorimetry (DSC)

Thermomechanical analysis (TMA)

Thermogravimetric analysis (TGA)

Dynamic thermomechanical analysis (DMA)

Thermal conductivity (steady state heat flow method, laser scattering method)

Pyrolysis analysis:

Pyrolysis gas chromatography-mass spectrometry

Gel permeation chromatography (GPC)

Melt index test (MFR)

Fracture analysis:

Scanning electron microscope (SEM), X-ray energy spectrometer (EDS), etc

Physical performance analysis:

Hardness tester, tensile testing machine, universal testing machine, etc

5. Failure analysis of composite materials

Composite materials are composed of two or more materials with different properties. It has the advantages of high specific strength, excellent toughness and good environmental resistance, so it can be widely used in practical production.

failure mode

Fracture, discoloration, failure, corrosion, insufficient mechanical properties, etc

Common means

NDT:

Radiographic testing technology (X-ray γ X-ray, neutron ray, etc.), industrial CT, Compton Backscatter Imaging (CST) technology, ultrasonic testing technology (penetration method, pulse reflection method, tandem method), infrared thermal wave testing technology, acoustic emission testing technology, eddy current testing technology, microwave testing technology, laser holographic testing method, etc.

Composition analysis:

For X-ray fluorescence spectrum analysis (XRF), see component analysis in failure analysis of polymer materials.

Thermal analysis:

Gravimetric analysis (TG), differential scanning calorimetry (DSC), static thermomechanical analysis (TMA), dynamic thermomechanical analysis (DMTA), dynamic dielectric analysis (deta)

Destructive test:

Slice analysis (metallographic slice, focused ion beam (FIB) sample preparation, ion grinding (CP) sample preparation)

6. Coating / plating failure analysis

Left IC delamination failure and right coating sample interface pitting corrosion failure

failure mode

Delamination, cracking, corrosion, blistering, coating / coating falling off, discoloration, failure, etc

Common means

Composition analysis:

See polymer failure analysis

Thermal analysis:

See polymer failure analysis

Fracture analysis:

Stereomicroscope (OM)

Scanning electron microscopy (SEM)

Physical properties:

Tensile strength, bending strength, etc

Relevant test standards

Application description of ci01 a013-2018 accreditation criteria for inspection institutions in the field of pressure vessel failure analysis

Gi003-2018 guidelines for accreditation requirements of pressure vessel failure analysis institutions

GB / T 15174-2017 reliability growth program

GB / T 15248-2008 test method for axial constant amplitude low cycle fatigue of metallic materials

GB / T 15824-2008 thermal fatigue test method for hot work die steel

GB / T 16778-2009 general procedure for failure analysis of fiber reinforced plastic structural members

GB / T 27938-2011 sliding bearing thrust washer failure and damage terms, appearance characteristics and causes

GB / T 32304-2015 requirements for electrostatic protection of aerospace electronic products

HB 7478-2014 qualification and certification of aviation equipment failure analysts

HB 7739-2004 failure analysis procedures and requirements for aviation metal parts.