Method, purpose and standard of semiconductor reliability test

Date：2021-11-23 14:32:02 Views：2970

Why semiconductor chip testing? The purpose of chip testing is to find no problem chips and save costs as much as possible. The complexity of the chip is getting higher and higher. In order to ensure the quality of the delivered chip without any problems, it is necessary to test before leaving the factory to ensure the functional integrity. As a large-scale production, large-scale automated testing is the only solution. It is impossible to complete such a task by manual or benchmark testing.

Semiconductor reliability test is mainly divided into two major items: environmental test and life test. The environmental test includes mechanical test (vibration test, impact test, centrifugal acceleration test, outgoing line tensile strength test and outgoing line bending test), outgoing line weldability test, temperature test (low temperature, high temperature and temperature alternating test) Damp heat test (constant humidity and alternating damp heat), special test (salt spray test, mold test, low pressure test, electrostatic resistance test, ultra-high vacuum test and nuclear radiation test); The life test includes long-term life test (long-term storage life and long-term working life) and accelerated life test (constant stress accelerated life, step stress accelerated life and sequential stress accelerated life), some of which can be done selectively.

Reliability test

1. Lower temperature limit working test: the test sample shall be powered on and run the test procedure for preliminary test. When the test sample does not work, gradually reduce the temperature in the box to 0 ℃. After the temperature is stable, power on and run the test program for 5h. The function and operation of the test sample shall be normal. After the test, take out the sample after the box temperature returns to room temperature and recover for 2h under normal atmospheric pressure.

Recommended inspection standard: the function and operation of the tested sample shall be normal, and there shall be no obvious deviation in appearance.

2. For low-temperature storage test, put the sample into the low-temperature box to reduce the box temperature to - 20 ℃, store it for 16h under the condition that the test sample does not work, take out the sample and return to the room temperature, and then restore it for 2h. Power on and run the test procedure for post inspection. The function and operation of the test sample shall be normal without obvious deviation in appearance. In order to prevent the test sample from frosting and condensation during the test, it is allowed to seal the test sample with polyethylene film and install moisture absorbing agent in the sealing sleeve if necessary.

Recommended inspection standard: the function and operation of the tested sample shall be normal, and there shall be no obvious deviation in appearance.

3. Initial test shall be conducted on the test sample of the upper temperature working test. When the test sample is not working, gradually raise the box temperature to 40 ℃. After the temperature is stable, power on and run the system diagnostic program for 5h. The function and operation of the test sample shall be normal. After the test, take out the sample after the box temperature returns to room temperature and recover for 2h under normal atmospheric pressure.

Recommended inspection standard: the function and operation of the tested sample shall be normal, and there shall be no obvious deviation in appearance.

4. High temperature storage test put the sample into the high temperature box to raise the box temperature to 55 ℃, store it for 16h when the test sample is not working, take out the sample and return to room temperature for 2h.

Recommended inspection standard: the function and operation of the tested sample shall be normal, and there shall be no obvious deviation in appearance.

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