Huawei announced patents related to "chip packaging components" and "detecting chip cracks"

Date：2021-12-06 11:55:25 Views：1390

Recently, good news came from Huawei. Through the unremitting efforts of technicians, Huawei has made progress in chip detection technology and disclosed the patent of "a device for detecting chip cracks", with the publication number of cn113748495a.

It is reported that the device includes a functional circuit (110) and a crack detection module (120) located around the functional circuit (110). The crack detection module (120) includes a front channel device layer (121) and a layered structure (122) arranged on the front channel device layer (121), a wire (L) is formed in the layered structure (122), and one or more first capacitors (C1) are formed in the front channel device layer (121). The first end of the wire (L) is used to connect the positive pole of the power supply, the second end of the wire (L) is used to connect the negative pole of the power supply, the first capacitor (C1) is connected in parallel between the first end of the wire (L) and the second end of the wire (L), a detection interface is set between the first end and the second end of the wire (L), and the detection interface is used to detect whether the chip is cracked.

According to the latest news, Huawei has also recently disclosed two chip patents, namely "packaging chip and manufacturing method of packaging chip" on September 28 and "manufacturing method of chip packaging components, electronic equipment and chip packaging components" on November 26

According to the patent sketch, Huawei connects the chip with the upper conductive layer and the lower conductive layer of the packaging substrate, so that the heat generated by the chip can conduct two-way heat dissipation, and a heat dissipation part is set on the upper conductive layer, so that the chip packaging components can achieve better heat dissipation effect. It has been disclosed before that 3D packaging, heterogeneous and other modes are within the scope of this packaging process. Although it is still uncertain whether it can really be realized, at least Huawei is making efforts in this direction.

It has to be said that these two chip patents are related to the packaging technology in the field of chip manufacturing, which also means that Huawei is constantly accelerating its R & D investment in the field of chip manufacturing technology. After all, the whole chip industry chain includes chip design, chip manufacturing and packaging. It can be said that there is a lot of technical knowledge. According to insiders, The chip technology patent disclosed by Huawei this time is related to the previously exposed "Huawei dual core superposition", including 3D packaging, heterogeneity and so on.