Electronic product testing organization: method of reliability testing chip

Date：2022-01-07 13:30:00 Views：1654

The quality of the chip is mainly determined by the market, performance and reliability. Firstly, in the early stage of chip development, it is necessary to fully investigate the market in order to define a spec that meets the needs of customers; The second is the performance. The circuit designed by the IC design engineer needs to pass designer simulation, DFT circuit verification, laboratory sample evaluation and FT before sample shipment to consider that the performance meets the requirements of the previous definition; Finally, reliability. Since the tested chip can only ensure that the customer is good when he first gets the sample, a series of stress tests are also required to simulate the impact of some harsh service conditions on the chip by the client, so as to evaluate the life of the chip and the possible quality risk.

Reliability technology concept

Reliability is the ability of a product to show a specific function in a specific time under standard technical conditions. Reliability is to measure the possibility of failure, the rate of failure, and the maintainability of the product. According to the technical specifications of products and the requirements of customers, we can perform reliability tests of different specifications such as MIL-STD, JEDEC, IEC, jesd, AEC, and EIA.

Type of testing machine

High temperature storage test (HTST)

Low temperature storage test (ltst)

Thst, temperature & humidity storage test

THB, temperature & humidity with bias test

High temperature steam pressure test (PCT / ub-hast)

Have, highly accelerated stress test

Temperature cycling test (TCT)

Temperature shock test (TST)

High temperature operation life test (HTOL)

High temperature bias test (BLT, bias life test)

Reflow test

Technical principle

Reliability can be defined as the probability that a product performs a specific function and successfully achieves its work goal within a given time under specific service environmental conditions. The environmental factors that directly affect reliability include temperature change, temperature, humidity, mechanical stress, voltage, etc. Reliability test is mainly aimed at the experiments of components in various environments to accelerate the aging and failure of components, so as to improve the design, materials or process parameters.

Environment test

High temperature storage test: accelerate the aging of components under high temperature. It can stabilize electrical performance and detect surface and bonding defects.

Low temperature storage test: mechanical deformation is caused by expansion and contraction at extremely low temperature. Cracks caused by embrittlement on the component structure.

Temperature humidity storage test: in a high temperature and humid environment, accelerate chemical reaction to cause corrosion. Test the corrosion resistance of components.

High temperature steam pressure cook test / high accelerated stress test: the principle is the same as that of temperature and humidity storage test. The difference is that in the humidification process, the pressure is greater than the atmospheric pressure, which accelerates the corrosion rate, causing poorly sealed products and internal corrosion.

Temperature cycle test: make the parts alternate several cycles of cold and heat, and make use of the difference of expansion coefficient to cause the impact on the components. It can be used to eliminate parts that fail due to temperature changes such as grain, wiring and packaging.

Thermal shock test: basically the same as the principle of temperature cycle test, the difference is to accelerate the speed of temperature change. Measuring the resistance of electronic parts exposed to extreme high and low temperatures can detect defects such as packaging and sealing, grain bonding, wire bonding, matrix cracks and so on.

High temperature operating life test: use high temperature and voltage acceleration methods to accelerate aging at high temperature, and then add signals to simulate the state of components performing their functions. The long-time operation life of IC products is evaluated by short-time experiments.

The precondition test performs the procedures of function measurement, appearance inspection, sat, temperature cycling, bake and moisture soak on the parts. The changes of transportation, storage and reflow experienced by the simulation components before they are used shall be used as the pretreatment of other reliability tests.

Transportation test

Vibration test: simulate the vibration environment generated during ground transportation or product operation. The original defects in the component structure will be constructed, and the deterioration of the defects will be accelerated through the vibration behavior, resulting in the failure of the component mechanism.

Mechanical shock test: slide the test piece at a certain height along the inclined slide rail and collide with the obstacles at the bottom to produce impact.

Reliability has been listed as an important quality index of products for assessment and inspection. For a long time, people only use the technical performance index of products as a symbol to measure the quality of electronic components, which only reflects one aspect of product quality, but can not reflect the whole picture of product quality. Because if the product is unreliable, even its technical performance can not be brought into play. In a sense, reliability can comprehensively reflect the quality of products. Our testing services include: electronic component testing and verification, IC true and false identification, product design and material selection, failure analysis, function testing, factory incoming material inspection, tape braiding and other testing items. Warmly welcome to call, we will serve you wholeheartedly.