- · IC Matters: Application Fields and Failure Factors of IGBT
- · Common testing methods and experiences for electronic components
- · About IC: Introduction to Infrastructure Diodes and Discrete and Integrated Circuits
- · The purpose of oblique impact testing for electronic components
- · The importance of connector insertion and extraction force testing
- · Test methods and items for secondary screening of electronic components
- · GBT 2423.22-2012 Environmental Testing Part 2: Test Methods Test N: Temperature Changes
- · GBT 2423.4-2008 Environmental Testing for Electrical and Electronic Products Part 2: Test Methods Test Db Alternating Damp Heat (12h+12h Cycle)
- · GBT 2423.2-2008 Environmental Testing for Electrical and Electronic Products Part 2 Test Methods Test B High Temperature
- · GBT 2423.1-2008 Environmental Testing for Electrical and Electronic Products Part 2 Test Methods Test A Low Temperature
- · AEC-Q100-004D: 2012 IC Latch Up Test - Complete English Electronic Version (11 pages)
- · CNAS-R01 Rules for the Use of Accreditation Marks and Declaration of Accreditation Status
Hong Kong Chuangxin Testing Laboratory: "Core" Dirty Engine, Silent Protection
Date:2025-09-18 16:18:16