Application of Xray technology in chip surface defect detection

Date：2021-08-24 18:39:00 Views：3261

Chip, the full English name is integrated circuit, referred to as IC, refers to the semiconductor components containing integrated circuits. Like the human brain, the chip receives information, sends instructions and controls the machine carrying the chip. General electronic components have corresponding technical parameters, which can be obtained from the standards of electronic chips and the technical data provided by manufacturers. Chip detection is an essential basic work. How to accurately and effectively detect the relevant parameters of the chip and judge whether the chip is normal is not a stereotype. Different methods must be adopted according to different chips to judge whether the chip is normal or not, and there are different types of tests.

In terms of performance and reliability, the appearance of forged electronic components is far from that of conventional products. Especially for those refurbished forged electronic components, after repeated welding and long-term use, some damage in the refurbishment process will greatly reduce the performance and reliability, and have a great negative impact on the product performance and stability.

With the continuous progress of modern technology, the appearance of forged electronic components becomes more and more realistic, which can not be distinguished by the naked eye. It was also at this time that X-ray appeared. It is a mature nondestructive testing method. At present, it is widely used in material testing (IQC), failure analysis (FA), quality control (QC), quality assurance and reliability (QA / REL), R & D and other fields. It can be used to detect the delamination, crack and other defects (crack, delamination, cavity, etc.) of electronic components, LEDs and metal substrates, judge whether there are defects in the material by detecting the image contrast, determine the shape and size of defects, and determine the orientation of defects. Compared with traditional destructive physical analysis and fault analysis, X-ray has the advantages of timeliness, cost and professionalism. They have obvious advantages.

Industry insiders engaged in X-ray nondestructive testing in related industries pointed out that X-ray testing equipment has a series of advantages such as nondestructive, easy to use and high testing accuracy. Through the detection equipment, the internal state of electronic components can be well detected, and even the angle, current, voltage and image of electronic equipment can be detected. The X-ray tube can pass through. In order to obtain the corresponding effective image information based on contrast and brightness, it can be well compared with conventional original products, so that the authenticity of components can be easily recognized.

Starting from wafer testing, thinning, slicing, rack mounting, bonding, electroplating, rib cutting and forming, final testing, until marking, the chip can be offline. Sealing and testing occupies the second half of chip production, almost completely depends on automatic equipment, and there are very few links requiring manual intervention. The IC industry has a huge market space. At present, there is still a large gap in China's IC test supply compared with the rapidly growing design and manufacturing market demand. X-ray is widely used in communications, semiconductors, chips, sensors, microelectronics and other fields to reduce testing and verification time and quickly improve product R & D and production efficiency. The existence of chips makes our life more convenient and beautiful. At the same time, in the information age, the high efficiency of chips promotes the continuous progress of science and technology.