What items need to be tested for components? Electronic product testing knowledge

Date：2021-11-16 13:45:14 Views：1776

Electronic component testing is the application of testing service industry technology in electronic information industry. It is an important link in the specific industrial chain of electronic components. The level of testing service technology is closely related to the quality of electronic components. This is also an essential basic work. How to accurately and effectively detect the relevant parameters of components and judge whether the components are normal is not a stereotype. Different methods must be adopted according to different components to judge whether the components are normal or not.

There are three main types of testing items for electronic components:

1. Routine test

It mainly tests the appearance, size, electrical performance and safety performance of electronic components

Basic parameters such as triode shall be tested according to the specifications of components, including appearance, size, Icbo, Vceo, Vces, HFE, pin tension, pin bending, weldability, welding heat resistance and other items. RoHS shall also be tested for some export products.

2. Reliability test

It mainly tests the service life and environmental test of electronic components

According to the requirements of the user and the specification, test the service life of the device and various environmental tests, such as triode, and carry out high-temperature test, low-temperature test, moisture test, vibration test, maximum load test, high-temperature durability test and other tests;

3. DPA analysis

It mainly controls the internal structure and process of the device

Such as triode, the main means include X-ray detection of internal structure, acoustic scanning monitoring of internal structure and packaging process, unsealing monitoring of internal wafer structure and size, etc. Among them, X-ray real-time imaging technology is increasingly widely used. It is favored by more and more electronic product manufacturers because of its non-destructive, fast, easy-to-use and relatively low cost. X-ray detection can be used to check the internal status of components, such as chip layout, lead layout, lead frame design, solder ball (lead), etc. For components with complex structure, the angle, voltage and current of the X-ray tube, as well as the contrast and brightness of the image can be adjusted to obtain effective image information.

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