Basic knowledge of patch welding three common welding technologies

Date：2022-03-03 15:23:00 Views：1560

With the progress of the times and science and technology, more and more circuit boards use chip components. SMT chip components are more and more popular because of their small size and easy maintenance. In PCBA processing, SMT chip components are particularly small in size and light in weight. SMT chip components are easier to weld than lead components. There is also a very important advantage of chip components, which is to improve the stability and reliability of the circuit. For PCBA processing, it is to improve the success rate of manufacturing.

The welding method of SMT chip components is as follows: put the components on the pad, and then apply the adjusted chip solder paste at the contact between the component pin and the pad (pay attention not to apply too much to prevent short circuit), and then heat the connection between the pad and SMT chip components with 20W internal heated electric soldering iron (the temperature should be 220 ~ 230 ℃), and remove the electric soldering iron after seeing the solder melt, After the solder solidifies, the welding is completed. After welding, you can use tweezers to clamp a clip of the components to be welded to see if they are loose. If they are not loose (they should be very strong), it means that the welding is good. If they are loose, you should apply some patch solder paste again and weld again according to the above method.

The three common welding technologies in patch processing are wave soldering, reflow soldering and laser reflow soldering.

1. Wave soldering technology

Wave soldering technology mainly uses SMT steel mesh and adhesive to firmly fix the electronic components on the printed board, and then uses wave soldering equipment to weld the circuit board patches immersed in molten tin. This kind of welding technology can realize the double-sided plate processing of patch, which helps to further reduce the volume of electronic products. However, this kind of welding technology has the defect that it is difficult to achieve high-density patch assembly processing.

2. Reflow soldering technology

Reflow soldering technology is to leak the solder paste on the electrode pad of electronic components according to the SMT steel mesh with appropriate specifications and models, so that the electronic components can be temporarily fixed in their respective positions, and then melt and flow the solder paste of each pin again according to the reflow welder, so as to fully moisten the electronic components and circuits on the patch and solidify them again. The reflow welding technology of SMT chip processing is simple and fast. It is a common welding technology in SMT chip processing manufacturers.

3. Laser reflow welding technology

Laser reflow welding technology is generally consistent with reflow welding technology. The difference is that laser reflow welding uses the laser to directly heat the welding position, resulting in the solder paste melting and flowing again. When the laser stops irradiation, the solder condenses again to form a stable and reliable welding connection. This method is faster and more accurate than the former, and can be regarded as an improved version of reflow welding technology.

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