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What are the meanings of CMA, CNAs and cal marks in the report of the third-party testing organization?

Date:2022-05-12 15:12:04

Generally, a test report will be marked with CMA, CNAs and cal. What do these three marks mean respectively? In order to help you have an in-depth understanding, the following contents are sorted out by Chuangxin testing network for your reference. View >>

The importance of CNAs certification! The difference between ISO Certificate and CNAs approval mark

Date:2022-05-11 17:48:18

As a widely recognized international certification, ISO system certification is widely recognized all over the world. Among them, ISO9001 quality management system, ISO14001 environmental management system and ohasa18001 occupational health and safety management system are familiar to everyone! So what is the difference between with CNAs logo and without logo? Why do some enterprises need certificates with marks? How big is the role? View >>

What is the difference between CMA cal and CNAs? Meaning and scope of each

Date:2022-05-11 17:43:19

CNAs international mutual recognition China's national accreditation system for conformity assessment plays an important role in international accreditation activities. Its accreditation activities have been integrated into the international recognition system and play an important role. View >>

What testing and certification are required for the export of electronic product performance testing?

Date:2022-05-11 17:30:00

As we all know, all products must have a certificate before they can be sold to consumers. From the initial model prototype to the hands of consumers, an important thing related to whether the electronic product can be delivered is to see whether the electronic product can pass the test of reliability test equipment. If electronic products want to get the certificate, they have to pass the test of reliability test equipment. The working principle of this reliability test equipment is to simulate the working environment of electronic products, let these electronic products test the working ability of high temperature and humidity resistance of these electronic products in different environments, such as high temperature and high humidity, and pass the test of these reliability test equipment, We can know the weakness of this type of electronic products View >>

Introduction to various technical knowledge of welding and assembly of electronic components

Date:2022-05-09 16:11:25

Components in electronic circuits are usually installed horizontally. Lead wires of electronic components shall be formed during installation. The forming of electronic component leads is mainly to meet the requirements of installation size and circuit board coordination. When forming the lead, it should be noted that the lead should not be bent at the root, and the fillet radius r at the bend should be greater than twice the lead diameter. The two bent leads shall be perpendicular to the component body and located in the same plane as the center of the component. View >>

What are the reliability test methods of lead-free solder joints?

Date:2022-05-09 16:05:28

Nowadays, in electronic assembly technology, people's awareness of environmental protection is becoming stronger and stronger. From the aspects of environmental protection, legislation, market competition and product reliability, lead-free is imperative. Lead free solder joints are polycrystalline eutectic. According to the principle of light diffusion, lead-free solder joints will not reflect light and show an "orange peel shape". In addition, the solidification of solder is accompanied by volume shrinkage, which is about 4%. Most of the volume shrinkage occurs at the last solidification of solder. View >>

What are the factors that determine the reliability of lead-free solder joints?

Date:2022-05-09 15:58:50

Welding process is an important measure to ensure welding quality. It can confirm the correctness and rationality of the welding process instructions prepared for various welding joints. Through the welding procedure qualification, check whether the service performance of the welded joint welded according to the proposed welding procedure instruction meets the design requirements, and provide a reliable basis for formally formulating the welding procedure instruction or welding procedure card. View >>

Welding process requirements basic requirements for lead-free solder in electronic assembly

Date:2022-05-09 15:48:45

The basic requirement of electronic assembly for lead-free solder is a control requirement of electronic equipment for solder. The basic process of lead-free solder assembly includes: A. lead-free PCB manufacturing process; b. 96.5sn/3.5ag and 95.5sn/4.0ag/0.5cu eutectic and near eutectic alloy systems used in solder paste; c. 99.3sn/0.7cu eutectic alloy system for wave soldering application; d. 99.3sn/0.7cu alloy system for manual welding. Although these are feasible processes, there are still several major problems in the specific implementation, such as the cost of raw materials is still higher than that of the standard Sn / Pb process, the restriction on the wettability is increased, the requirement to maintain the inert air state (sufficient nitrogen) in the wave soldering process, and View >>

What are the methods of metal failure analysis? Main test items and standards

Date:2022-04-29 14:45:58

With the rapid development of science and technology and industrial production, people have higher and higher requirements for the quality of mechanical parts. Although the quality of materials and the precision of parts have been greatly improved, the early failure of mechanical parts used in various industries still occurs from time to time. Through failure analysis, it is essential to find out the failure causes and put forward effective improvement measures to prevent the recurrence of similar failure accidents, so as to ensure the safe operation of the project. View >>

What are the test methods for reliability analysis of lead-free solder joints

Date:2022-04-29 14:23:36

Product inspection is an essential means of quality control in the production of modern electronic enterprises. It mainly plays the role of process control, quality control and judging the qualification of products. The product inspection shall implement the "three inspection" system combining self inspection, mutual inspection and full-time inspection. SMT packaging technology widely used in electronic packaging, new chip size packaging (CSP), solder ball array (BGA) and other packaging technologies require the direct realization of electrical and rigid mechanical connection between different materials through solder joints (mainly bearing shear strain). Its quality and reliability determine the quality of electronic products. View >>

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