Date：2021-12-31 16:39:18

Circuit board soldering has always been a common problem in the electronic industry. Due to the compact, complex internal structure and miniaturized shape of electronic products, ordinary testing instruments can not detect their internal defects. Therefore, it is difficult to solve the problem of how to effectively detect circuit board soldering. After many experimental studies, X-ray detection equipment has been recognized by more and more people, and its efficiency and effect of circuit board false soldering detection are both worry-saving and labor-saving. View >>

Date：2021-12-31 16:34:29

With the increasing demand for miniaturization of electronic equipment, there are more and more functions of a single chip. In the prior art, in order to ensure the quality of the chip, the process from design molding to mass production usually includes the chip detection stage. Integrated circuit, English is integrated circuit, abbreviated as IC; As the name suggests, it is a circuit with specific functions that integrates a certain number of common electronic components, such as resistors, capacitors, transistors, etc., as well as the wiring between these components through semiconductor technology. View >>

Date：2021-12-31 15:44:40

Most commonly used components are first packaged, then packaged, and then shipped to customers. The packaging method of surface assembled components has become an important link in SMT system. It directly affects the efficiency of assembly and production. It must be optimized in combination with the type and number of feeders of mounter. This paper has collected and sorted out some materials, and I hope this paper can be of great reference value to all readers. View >>

Date：2021-12-31 15:40:00

With the increasingly stringent requirements of society, laws and regulations on environmental protection and energy saving, the quality requirements of aluminum castings have also been improved. Therefore, the inspection of aluminum castings is paid more and more attention by manufacturers. Aluminum castings are widely used in many industries, including automobile industry, instrument industry, agricultural machinery, machine tool industry and so on. View >>

Date：2021-12-30 15:56:00

RoHS is the abbreviation of "restriction (use of certain) hazardous substances in electronic and electrical equipment". The initial abbreviation RoHS is used in EC Directive 2002 / 95 / EC. For the sake of clarity, major changes have led to the revision of EU provisions (EU RoHS) in 2011 / 65 / EU directive of June 8, 2011. For the delivery in China, There are similar requirements in GB / T 26572-2011 "concentration limit requirements for certain restricted substances in electrical and electronic products" (China RoHS). View >>

Date：2021-12-30 15:21:00

In order to adapt to the restriction requirements of new types of hazardous substances and the development of new detection technology in the electronic and electrical industry, and promote rohs2 0 detection technology development, while ensuring rohs2 0 the test results are consistent with the international ones, and China's rohs2 0 the working group initiated the revision of GB / T 26125-2011 and equivalent transformation of a series of standards revised and issued by IEC 62321 to support the implementation of the administrative measures for the restriction of the use of hazardous substances in electrical and electronic products and China rohs2 0 implementation of conformity assessment. View >>

Date：2021-12-30 14:08:53

Generally, the weldability of low carbon steel is better than that of other steels. And the lower the carbon content, the better. The higher the carbon content, the worse the weldability. The weldability of alloy steel depends on the different alloy elements added. Generally, the weldability of chromium containing steel is better than that of vanadium containing steel. It is of great help to the level 1 (IC packaging) and level 2 (electronic components assembled to printed circuit board) processes of modern electronic industry, which need high-quality interconnection technology and high-quality and zero defect welding process. View >>

Date：2021-12-30 14:04:00

With the development of the times, PCB circuit board plays an important role. The competition of terminal products is becoming increasingly fierce, which is bound to put forward higher requirements for the reliability of PCB products. When designing a reliable circuit board, you need to follow the same PCB design process. When designing a key circuit, its components and quality must be checked first, and a number of reliability tests must be carried out. View >>

Date：2021-12-29 14:27:16

Chip reliability test is mainly divided into two major items: environmental test and life test. The environmental test includes mechanical test (vibration test, impact test, centrifugal acceleration test, outgoing line tensile strength test and outgoing line bending test), outgoing line weldability test, temperature test (low temperature, high temperature and temperature alternating test) Damp heat test (constant humidity and alternating damp heat), special test (salt spray test, mold test, low pressure test, electrostatic resistance test, ultra-high vacuum test and nuclear radiation test); The life test includes long-term life test (long-term storage life and long-term working life) and accelerated life test (constant stress accelerated life, step stress accelerated life and sequential stress accelerated life), some of which can be done selectively. View >>

Date：2021-12-29 14:06:43

Electronic packaging is the process of converting chips into devices that can work reliably in the electronic manufacturing industry chain. Because bare chips can not withstand the load of the working environment for a long time and lack the necessary electrical signal connection, they can not be directly used in electronic equipment. Therefore, although different types of products are different, the main functions of electronic packaging are relatively similar, mainly including four functions: mechanical support, fixing the chip and other internal components in the specified position; Environmental protection to protect the chip from external loads such as water vapor, corrosion, dust and impact; Interconnection of electrical signals to provide electrical path and power supply for internal components; Heat dissipation to export the heat generated during chip operation in time [1]. According to different process stages, electronic packaging can generally be divided into zero level packaging (chip level interconnection) and first level packaging (chip level packaging) View >>