Date：2021-09-06 17:17:06

With the continuous progress of science and technology, modern society is closely related to electronic technology. It is unable to effectively ensure the product qualification rate of its electronic components, especially for packaging companies (such as BGA). The quality of solder joints is very important to determine the reliability and performance of SMT components, and the quality of BGA Solder Joints should be the key. Therefore, it is very important to take effective measures to ensure the solder joint quality of BGA components and realize the final reliability of SMT components. View >>

Date：2021-09-06 15:58:00

In the high-tech application scenario of electronic equipment, large-scale integrated circuit packaging has attracted extensive attention. Some large-scale integrated circuit packaging can be connected with hundreds of external connections based on their huge functions. On the chip bottom of several square centimeters to tens of square centimeters, dense connection line nodes are regularly distributed. View >>

Date：2021-09-06 15:48:39

With the progress of electronic technology, electronic products begin to develop to light, thin and small, and their functions are more advanced. After several generations of upgrading, BGA (grid array) has become a high-density chip packaging technology entering the practical stage. How to ensure BGA package welding quality? How to detect BGA quality? How to determine the location of BGA defects? It is the key to ensure the quality of bgasmt. View >>

Date：2021-09-03 13:30:44

With the advent of the electronic information age, there are a wide range of electronic products on the market, as well as various electronic components such as IC chips and diodes. If you don't pay attention to the distinction, it is sometimes difficult to see the difference between various materials and chip quality. We should fully understand the working principle of the chip before starting the chip test process. Be familiar with its internal circuit, main parameters, functions of each outgoing line and its normal voltage. The chip is very sensitive, so pay attention not to cause a short circuit between the pins during the test. The short circuit at any moment can be captured, causing the chip to burn out. The following mainly introduces the visual inspection of appearance defects. Let's have a look! View >>

Date：2021-09-03 13:22:00

ROHS certification is a mandatory standard formulated by EU legislation. Its full name is the restriction of hazardous substances. For enterprises, if they do not implement the mandatory certification standards, they will violate the law and regulations. Not only the products exported by enterprises will be detained in EU countries, but also the reputation, brand culture and good reputation of enterprises will be affected. We need to realize the importance of RoHS. View >>

Date：2021-08-31 13:26:38

X-ray testing technology is one of the five traditional non-destructive testing methods, which has been widely used in industry. It is applicable to metal detection and non-metal detection. Radiation detection can be carried out for possible defects in metal, such as holes, pinholes, inclusions, looseness, cracks, segregation, incomplete penetration and insufficient fusion. Applications include special equipment, aerospace, ships, weapons, hydraulic equipment and bridge steel structures. View >>

Date：2021-08-31 13:19:00

LED packaging technology is mostly developed and evolved on the basis of discrete device packaging technology, but it has great particularity. With the rapid growth of the application market, it has rapidly expanded the huge market of LED packaging products and spawned tens of thousands of LED packaging enterprises. LED is an electroluminescent semiconductor material chip, which is solidified on the support with silver glue or white glue, then connected with the chip and circuit board with silver wire or gold wire, sealed with epoxy resin around to protect the internal core wire, and finally installed the shell. View >>

Date：2021-08-26 17:27:00

The State Administration of market supervision (State Standardization Administration) has approved 450 recommended national standards such as the determination of silicon content in iron, steel and alloy by inductively coupled plasma atomic emission spectrometry and the amendment list of 4 national standards, which are hereby published. View >>

Date：2021-08-26 14:25:58

With the research and development of some major nondestructive testing instruments included in the national development special plan, China's nondestructive testing technology has developed on a much higher platform than ever before. Nondestructive testing refers to the method of detecting the internal defects, properties and states of the tested structure by using various physical fields on the premise of not damaging the tested object. This paper collects and arranges some relevant knowledge of nondestructive testing. It is expected that this paper will have great reference value to all readers. View >>

Date：2021-08-26 14:14:00

Industrial CT needs the assistance of computer software, so although the relevant mathematical theory of tomography was put forward by J. radon as early as 1917, it only became a new imaging technology after the emergence of computer and combined with radiology. It shows its uniqueness in industry, especially in the field of nondestructive testing (NDT) and nondestructive evaluation (NDE). Therefore, the international nondestructive testing community calls industrial CT the best nondestructive testing method. View >>