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What are the NDT methods for defect detection and welding quality?

Date:2022-07-13 14:58:24

Welding defect refers to the defect formed in the welding process of the welded joint. Product surface defect detection is an important link in industrial production and a key step in product quality control. With the help of defect detection technology, production quality and efficiency can be effectively improved. In order to help you have an in-depth understanding, this paper will summarize the relevant knowledge of welding nondestructive testing. If you are interested in what this article will cover, then read on. View >>

Summary of common NDT methods for NDT

Date:2022-07-13 14:55:23

In short, nondestructive testing is to use the characteristics of sound, light, magnetism and electricity inside the inspection machine to detect whether there are defects or nonuniformity in the inspected object without damaging or affecting the service performance of the inspected object, give the size, location, nature and quantity of defects and other information, and then determine the technical state of the inspected object (such as qualified or not, residual life, etc.), This is a kind of testing method that does not damage or affect the future performance or use of materials or workpieces. The following mainly introduces the summary of common NDT methods. View >>

Welding quality inspection what are the technical requirements for circuit board welding?

Date:2022-07-12 18:28:46

Welding, as an industrial "tailor", is a very important processing means in industrial production. The quality of welding plays a decisive role in product quality. In circuit board proofing, welding is a very important process. Then, what are the technical requirements for circuit board welding? Come and have a look! View >>

IC reliability test project semiconductor third-party testing organization

Date:2022-07-12 18:15:48

It is understood that the reliability test equipment can simulate the environment and ensure that the product meets the expected quality objectives in research, development, design and manufacturing through testing. On the one hand, this detection method can ensure the quality of enterprise products, but also enhance the competitiveness of enterprise products in the market. The first miracle of modern semiconductor IC design is that they can contain highly complex electronic circuits in such a small space. Manufacturers of these technological miracles must ensure that the equipment they produce can meet the performance expectations of end users and meet the expected service life requirements. View >>

What are the main reasons for the failure analysis of PCBA solder joints?

Date:2022-07-11 17:39:30

Correctly identifying and mitigating the potential causes of solder joint failure in the design and manufacturing process can prevent costly and difficult problems from occurring at the end of the product life cycle. However, in the actual processing process, we will also encounter the problem of PCBA solder joint failure. It is necessary to analyze and find out the cause to avoid the recurrence of solder joint failure. In order to help you understand in depth, this paper will summarize the relevant knowledge of PCBA solder joint failure analysis. If you are interested in what this article will cover, then read on. View >>

Testability concept of PCB design professional testing organization

Date:2022-07-11 17:30:00

The testability of product design (de sign for testability. oft) is also the main content of product manufacturability. From the perspective of production, it is also one of the processibility of design. It refers to considering the degree of difficulty that the product performance can be tested when designing, that is, how to test the product performance and processing quality in the simplest way when designing the product, or the product design should make it easy for the product to test its performance and quality according to the specified method as far as possible. Especially the design of electronic products is essential to the performance test of products. View >>

A brief introduction to the practical method of improving the stability of chip on-line burning

Date:2022-07-08 16:57:15

In order to improve the burning efficiency, some jigs and burning tooling are usually made. Fixtures, tooling and programmers need long wiring, and the length of the wire will affect the strength of signal transmission. Generally speaking, the longer the line, the weaker the signal. When the signal is weak, the bad burning rate will increase. View >>

Specific steps and methods of IC chip burning program

Date:2022-07-08 16:45:53

IC burning refers to brushing software (also known as firmware) in IC. Burning chip means copying IC chip; It can also be said to write programs to programmable devices, such as microcontrollers. In English, it is called download, or download program. That is to store program files in the chip, that is, input data; Burning chip has a special editor called burning chip device, which is specifically divided into six tube test burning, semi-automatic burning, full-automatic burning, etc. Generally speaking, the goods produced by the original factory are not burned, but there should be a certain code in essence. This is a necessary process more important than IC testing, which is usually completed by the final electronic product manufacturer. So what should we pay attention to when burning IC chips? What are the specific steps? View >>

Reliability analysis standard and criterion of electronic product package drop test

Date:2022-07-07 15:35:29

In fact, the factors that affect the quality evaluation of packaging and transportation are far more than these. The purpose of package drop test is to simulate the situation when products fall to the ground at different edges, corners, surfaces and heights after packaging, so as to understand the damage of products and evaluate the degradation height and impact strength that product packaging components can bear when falling, so as to improve and perfect the packaging design according to the actual situation of products and the scope of national standards. View >>

What are the reliability test items of high voltage ceramic capacitors?

Date:2022-07-07 15:32:21

People in the electronic components industry know that high-voltage ceramic capacitors are used in TV receivers and scanning circuits. Reliability test is generally carried out in the stage of product development and production. It is a means to investigate, analyze and evaluate the reliability of products. The test results can provide a basis for fault analysis, study the corrective measures taken, and judge whether the product meets the index requirements. View >>

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