Date：2021-10-26 17:46:00

Failure analysis is a new developing subject, which has been popularized from military industry to ordinary enterprises in recent years. It is generally based on the failure mode and phenomenon, through analysis and verification, simulate and reproduce the failure phenomenon, find out the cause of failure, and dig out the failure mechanism. It has strong practical significance in improving product quality, technology development and improvement, product repair and arbitration of failure accidents. The methods are divided into destructive analysis, nondestructive analysis, physical analysis, chemical analysis and so on. View >>

Date：2021-10-25 16:14:00

The damage probability of circuit board components is as follows: electrolytic capacitor, power module, high-power transistor, zener diode, resistance less than 100 Ω, resistance greater than 100k Ω, relay and porcelain chip small capacitance. Electronic components are divided into two categories: components and devices. The quality of the test is generally measured with a multimeter, and the components are mainly checked according to their own characteristics. In the maintenance process, use a multimeter to detect the quality of electronic components according to the fault conditions. If the measurement method is incorrect, it is likely to lead to misjudgment, which will cause difficulties to the maintenance work and even unnecessary economic losses. View >>

Date：2021-10-25 16:08:00

The test to evaluate and analyze the reliability of electronic products is called reliability test. For different products, in order to achieve different purposes, different reliability test methods can be selected. Reliability test is also called product reliability. It refers to the ability of a product to complete specified functions under specified conditions and within specified time. In the process of design and application, the product is constantly affected by its own and external climate environment and mechanical environment, but still needs to work normally. Therefore, it needs to be verified with test equipment. This verification is basically divided into three parts: R & D test, trial production test and mass production sampling inspection. View >>

Date：2021-10-22 16:39:00

Electronic components are the most basic components of products, and their quality level will have a vital impact on the stability and reliability of the whole system. Screening of electronic components is to conduct a full batch non-destructive test on the whole batch of electronic components through a series of short-term environmental stress accelerated tests and testing technologies, select qualified components with characteristics or determine whether the batch of products are accepted, so as to improve the service reliability of products. View >>

Date：2021-10-22 16:12:00

With the rapid development of science and technology and industrial production, people have higher and higher requirements for the quality of mechanical parts. Although the quality of materials and the precision of parts have been greatly improved, the early failure of mechanical parts used in various industries still occurs from time to time. Through failure analysis, it is essential to find out the failure causes and put forward effective improvement measures to prevent the recurrence of similar failure accidents, so as to ensure the safe operation of the project. Failure analysis is an independent discipline. It was first applied in military industry. With the continuous improvement of this discipline, its application scope is also expanding. View >>

Date：2021-10-22 15:28:00

For beginners of electronic technology, mastering the basic circuit principle, the functional characteristics and detection of components, and how to analyze the schematic diagram are all basic skills that need to be mastered. Here's how to identify the components on the circuit board? Circuit boards often need maintenance. What are the rules for the maintenance of industrial PCB circuit boards? The components on the circuit board should not only be known, but also the vulnerable parts on the circuit board during maintenance. View >>

Date：2021-10-22 14:35:00

Fracture refers to the phenomenon that metal or alloy materials or mechanical products are divided into several parts under the action of force. It is a dynamic change process, including crack initiation and propagation. Fracture failure refers to the failure of mechanical equipment products caused by the fracture of mechanical components to complete the functions required by the original design. Fracture failure types are as follows: View >>

Date：2021-10-21 18:15:03

Semiconductor chip IC is very sensitive, so when testing, pay attention not to cause short circuit between pins. Short circuit at any moment can be captured, resulting in burn out of integrated circuit. All the components have formed a whole in structure, which makes the electronic components take a big step towards miniaturization, low power consumption, intelligence and high reliability. The work to be done before testing is to fully understand the working principle of integrated circuits. Be familiar with its internal circuit, main parameters, functions of each outgoing line and its normal voltage. View >>

Date：2021-10-21 17:26:00

IC, BGA and other devices are called humidity sensitive devices. Their storage and baking are based on the requirements of IPC standards. Using a certain process, the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit are interconnected, fabricated on a small or several small semiconductor chips or dielectric substrates, and then encapsulated in a tube shell to become a micro structure with the required circuit functions. This structural feature determines that integrated circuit chips will be composed of different materials. The joint of these materials will produce more or less gaps. These gaps may not be visible to the naked eye, but when the integrated circuit chip is placed in the environment, the water in the environment will penetrate into the chip through infiltration. And cause the chip to be damp. View >>

Date：2021-10-21 16:56:00

Integrated circuits are divided into commercial devices, industrial devices, automotive industrial devices and military devices. The operating temperature range is also different. Commercial grade devices are 0 ~ + 70 ℃, industrial grade devices are - 40 ~ + 85 ℃, automotive industrial grade devices are - 40 ~ + 125 ℃, and military grade devices are - 55 ~ + 155 ℃. We can judge whether the device can be baked according to the temperature level and baking temperature of the device. This paper has collected and sorted out some data, and we hope this paper can be of great reference value to all readers. View >>