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Sharing of sample selection methods for metallographic analysis

Date:2022-11-07 16:28:00

The sample selection is the first step of metallographic analysis. The quality of sample selection directly determines the quality of the experimental results, and its importance is beyond doubt. Metallographic analysis is one of the important means of metal material test and research. Based on the principle of quantitative metallography, the three-dimensional spatial morphology of the alloy structure is determined by the measurement and calculation of the metallographic microstructure of the two-dimensional metallographic sample grinding surface or film, so as to establish the quantitative relationship between the alloy composition, structure and properties. View >>

Several Mosaic Methods of Metallographic Specimens

Date:2022-11-07 16:00:00

Metallographic sample inlay (also known as inlay) refers to the need to inlay or clamp when the size of the sample is too small or the shape is irregular, which makes it difficult to grind and polish, so that the sample can be polished easily, and the work efficiency and accuracy of the experiment can be improved. The inlay is generally divided into three types: cold inlay, hot inlay and mechanical clamping. The samples to be inlaid are as follows: View >>

Introduction of commonly used methods for measuring the depth of decarburized layer

Date:2022-11-04 14:30:00

Decarburization is the phenomenon that all or part of the carbon on the steel surface is lost due to the oxidation atmosphere during the heating or insulation process of various hot working procedures. The depth of decarburized layer refers to the distance from the surface of decarburized layer to the matrix of decarburized layer where the difference in metallographic structure can no longer be distinguished. The following is a brief analysis of the decarburization layer depth testing method for your reference. View >>

How to grind the metallographic specimen? Detailed step process

Date:2022-11-04 14:08:00

To correctly inspect and analyze the microstructure of metals, excellent metallographic samples must be available. The prepared sample shall be able to observe the real structure, without abrasion marks, pitting and water marks, and keep the inclusions, graphite, etc. in the metal structure from falling off. Otherwise, the correctness of microscopic analysis will be seriously affected. The preparation of metallographic samples includes several steps, such as sampling, grinding, polishing, and microstructure display (etching). View >>

Summary of problems in X-ray weld inspection of electronic components

Date:2022-10-28 16:15:02

With the progress of science and technology, the circuit board is filled with smaller and smaller components, and the solder joint detection is also required to ensure the normal operation of the circuit board when welding is carried out by machine or manual. X-ray makes use of the penetrability of X-rays. Because of its short wave length and large energy, it can easily penetrate the tested materials. When the X-rays penetrate materials and do not penetrate materials to form differences, the materials with different densities can be distinguished by using the property of differential absorption. View >>

What are the contents of chip testing? IC Chip Reliability Test Standard

Date:2022-10-28 16:13:28

Chips play a similar role to human organs in various electronic devices. In order to achieve this level of reliability, testing and measurement play a vital role in the whole process of chip design and package testing. While semiconductor manufacturing plants accurately control each process parameter of the chip, they will also test at each stage of production to eliminate defective parts as soon as possible. Next, we will briefly introduce the IC chip reliability test, let's have a look! View >>

How to choose the appropriate burning mode for different chip models?

Date:2022-10-27 11:00:00

Chip burning refers to the chip brushing software, also known as firmware. Generally, the goods delivered by the original factory have not been burned, but they have certain codes in essence. The process of "transporting" the program to the internal memory space of the chip is called burning, and the burning methods are generally divided into offline burning and online burning. Different burning methods will affect the production process of the factory, the design of tooling and fixtures, etc. How to choose the appropriate burning mode for different chip models? View >>

What is the purpose of FMEA for the three elements of fmea risk assessment?

Date:2022-10-27 11:00:00

FMEA is a systematic activity in the product design stage and the process design stage, which analyzes the subsystems and parts constituting the product and each process constituting the process one by one, finds out all potential failure modes, and analyzes their possible consequences, so as to take necessary measures in advance to improve the quality and reliability of the product. This paper collects and sorts out some materials, hoping to be of great reference value to all readers. View >>

Low temperature welding tools and precautions for electronic components

Date:2022-10-26 16:13:45

Metal welding is a relatively technical process, so it is often difficult to operate. During low-temperature welding construction, attention shall be paid to temperature, welding materials, preheating, welding seam and cooling. At low temperature, the surface of weldment is easy to frost and slide, which brings difficulties to welding operation. Therefore, the following links should be paid close attention to when using welding tools to ensure that the welding process is completed with high quality under low temperature environment. View >>

How to select NDT methods? Comparison of four NDT methods

Date:2022-10-26 16:11:44

Non destructive testing refers to a test method to inspect the surface and internal quality of the inspected parts without damaging the working conditions of the workpiece or raw materials. It is a test method to inspect the surface and internal quality of components. It is the general term of all technical means to detect whether there are defects or nonuniformities in the inspected object by using acoustic, optical, magnetic, electrical and other characteristics without damaging or affecting the service performance of the inspected object, and to give the size, location, nature, quantity and other information of defects, so as to determine the technical state (such as whether the inspected object is qualified, remaining life, etc.) of the inspected object. View >>

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