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What are the testing methods for material composition? Common detection techniques

Date:2022-11-23 15:19:35

Component analysis refers to the technical method of analyzing the components of products or samples through scientific analysis methods, and conducting qualitative and quantitative analysis on each component. In order to help you understand deeply, this article will summarize the relevant knowledge of material composition testing. If you are interested in the content to be covered in this article, please read on. View >>

Analysis on Application of Electronic Welding Process for X-Ray Inspection of Components

Date:2022-11-21 17:38:37

The detection of electronic components is actually the detection of electronic components and electronic devices. Electronic components refer to products that do not change their components during production and can work without energy, such as resistance, capacitance, etc. It mainly includes performance and appearance quality, which directly affect the reliability of SMT components. This paper collects and sorts out some materials, hoping to be of great reference value to all readers. View >>

Analysis of the main causes of solder joint failure due to wave of welding knowledge

Date:2022-11-18 14:27:21

Wave soldering is a necessary equipment in the welding of electronic product plug-ins. However, faults caused by poor wave soldering, faulty solder joints and poor conductivity occur from time to time. To solve the problems, it is necessary to know the main causes of wave soldering defects. In order to help you understand, the following contents are organized by the Core Creation Testing Network for your reference. View >>

What conditions are required for PCB welding environment?

Date:2022-11-18 14:26:35

When PCBA is welded, there are usually many requirements for PCBA plates, and the plates must meet the requirements before they can be welded. The application of special processes immediately brings about the requirements for PCB boards. If PCB boards have problems, it will increase the difficulty of PCBA welding process, which may eventually lead to welding defects, unqualified boards, etc. Welding is a very important process in PCB proofing. What are the requirements for PCB welding environment? View >>

What are the main failure forms of mechanical parts failure analysis?

Date:2022-11-17 16:00:08

When a mechanical part loses its working ability or fails to meet the design requirements due to some reasons, it is called failure. The results of failure analysis can not only predict the failure form of parts, but also serve as the basis for selecting materials for parts. At the same time, they can provide instructive data for reasonably formulating the manufacturing process of parts, optimizing the structural design of parts, and developing new materials and processes. This paper collects and sorts out some materials, hoping to be of great reference value to all readers. View >>

What are the differences between wave soldering and manual soldering?

Date:2022-11-17 15:57:59

In PCBA processing, the welding methods mainly include reflow welding, wave soldering and manual welding. What is the difference between wave soldering and manual soldering? Now, what are the differences between wave soldering and manual soldering in PCBA processing? View >>

Technical requirements and operation precautions for wave soldering process

Date:2022-11-16 16:04:23

Wave soldering refers to the soldering of melted soft solders into solder peaks as required by the design by spraying them through an electric pump or an electromagnetic pump. It can also be formed by injecting nitrogen into the solder pool, so that the printed boards with components in advance can pass through the solder peaks to realize the soft soldering of mechanical and electrical connection between the component terminals or pins and the printed board pads. Next, the technical requirements and operation precautions of the down wave soldering process will be described in detail. View >>

Requirements and standards for reliability test application

Date:2022-11-16 16:04:12

Reliability test is a test designed and conducted according to reliability requirements, with reliability objectives and under typical environmental conditions. It is a test to verify whether the product can achieve the intended function under specified conditions and within specified time, It is the general term of reliability growth test (reliability growth test is a test that exposes potential defects of products and takes corrective measures to make the reliability of products meet the predetermined requirements by applying real or simulated comprehensive environmental stress to products), reliability development test and reliability verification test. View >>

Sharing of various diode testing methods for electronic component testing

Date:2022-11-15 16:29:32

As the most basic transistor, diode is ubiquitous in electronic circuit applications. Whether it is level conversion circuit, automatic power switching circuit, anti reverse connection circuit, there is the shadow of diode. In order to help you understand deeply, this article will summarize the relevant knowledge of various diode detection methods. If you are interested in the content to be covered in this article, please read on. View >>

What are the causes of component failure? General Procedures for Failure Analysis

Date:2022-11-15 16:25:47

Generally speaking, it is inevitable that errors occur in the development and production of chips. Failure analysis is a technical and management activity to judge the failure mode of the product, find out the failure mechanism and reason of the product, and put forward countermeasures to prevent re failure. With the continuous improvement of people's requirements for product quality and reliability, failure analysis is becoming more and more important. The development of society is a process of finding and solving problems. Problems are not terrible, but frequent occurrence of the same type of problems is very terrible. View >>

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