Date：2022-08-05 15:33:27

The detection of electronic components is not only an important link to ensure the normal operation of components, but also the most basic work. There are many kinds of components, and their working principles and technical characteristics are different. In practical work, different detection methods should be selected for different components. In the screening of electronic components, we should pay attention to quality control, overall consideration, scientific selection, simplified design, rational use of performance parameters of components, and give full play to the function of electronic components. Make reasonable selection according to favorable conditions, simplify the circuit design and improve the reliability, and reduce the rating to improve the reliability. View >>

Date：2022-08-03 18:05:44

At present, soldering technology is mainly used in the welding of electronic components. Tin welding uses tin alloy materials dominated by tin as solder. The solid solder wire is heated and melted by the heated electric iron, and then flows into the metal to be welded with the help of flux. Because the metal weldment and tin atoms attract, diffuse and combine with each other to form a wetted bonding layer, a firm and reliable welding point can be formed after cooling. In order to help you understand in depth, the following contents are sorted out by Chuangxin testing network for your reference. View >>

Date：2022-08-03 18:03:55

Reliability design is an important part of the overall engineering design of the system. It is a series of analysis and design techniques to ensure the reliability of the system. As an important component in an electronic system, the reliability of power supply determines the reliability of the whole system. Switching power supply is widely used in various fields because of its small size and high efficiency. How to improve its reliability is an important aspect of power electronics technology. View >>

Date：2022-08-02 18:08:39

In the process of using connectors, it is inevitable to encounter the failure of connectors. Although each connector has a rated service life, for connectors used in industrial machinery and equipment, some factors will also lead to premature failure of connectors, and even damage to expensive machinery and equipment. This article will introduce the causes of connector connection failure. In addition, this paper will also describe the matters needing attention in the test of board to board connectors. View >>

Date：2022-08-02 17:45:57

High and low temperature test is used for adaptability test of electrical, electronic products, components and materials when they are stored, transported and used in high and low temperature environment, and whether electronic products can adapt to harsh environment. High and low temperature experiment is a necessary test item for product reliability. What adverse effects will high and low temperature have on products? This article has collected and sorted out some materials, which are expected to be of great reference value to readers. View >>

Date：2022-07-29 14:37:47

Material fatigue test technology refers to the technology that characterizes the degradation of mechanical properties of materials under alternating load, which is widely used in the study of fatigue resistance of materials and components such as metals, rubber, composites and so on. Fatigue test can predict the fatigue strength of materials or components under alternating load. Generally, this kind of test cycle is long and the required equipment is complex. However, because general mechanical tests such as static tension, hardness and impact tests can not provide the performance of materials under repeated alternating load, it is necessary to carry out fatigue test for important components. This article has collected and sorted out some materials, which are expected to be of great reference value to readers. View >>

Date：2022-07-29 14:29:47

Failure analysis can evaluate the effectiveness of different test vectors, provide necessary supplements for production testing, and provide necessary information basis for verification test process optimization. Failure analysis often requires electrical measurement and advanced physical, metallurgical and chemical analysis methods. The purpose of failure analysis is to determine the failure mode and failure mechanism, put forward corrective measures, and prevent the recurrence of this failure mode and failure mechanism. Failure mode refers to the observed failure phenomena and forms, such as open circuit, short circuit, parameter drift, function failure, etc. Failure mechanism refers to the physical and chemical processes of failure, such as fatigue, corrosion and overstress. The following is a brief analysis of the failure analysis steps of integrated circuits for your reference. View >>

Date：2022-07-29 14:14:01

Welding materials shall meet the design requirements and relevant standards, and quality certificates and baking records shall be checked. View >>

Date：2022-07-28 16:00:00

Electronic components often fail in the process of use. Failure means that the circuit may fail, thus affecting the normal operation of the equipment. The failure causes and common faults of common components are analyzed here. Most of the faults in electronic equipment are ultimately caused by the failure of electronic components. If you are familiar with the failure causes of components and locate the failure causes of components in time, you can eliminate the faults in time and make the equipment operate normally. View >>

Date：2022-07-28 15:00:00

In order to obtain the sensitive environment of electronic components, the typical failure modes related to the environment are analyzed, as shown in the table. View >>