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Reliability test: main factors and reference standards affecting weldability

Date:2021-07-27 15:35:00

Solderability test, English is "solderability". It refers to the qualitative and quantitative evaluation of the weldability of components, PCB boards, pads, solders and fluxes through the principle of wetting balance. It is of great help to the level 1 (IC packaging) and level 2 (electronic components assembled to printed circuit board) processes of modern electronic industry, which need high-quality interconnection technology and high-quality and zero defect welding process. View >>

How to troubleshoot and deal with the failure of electromagnetic relay?

Date:2021-07-27 09:38:00

Recently, the innovation test received a batch of fault relays. According to the customer's description, some of these relays did not work during workshop commissioning, and the defect rate was 10%. The appearance of the fault relay is shown in the figure below. It belongs to Panasonic brand and the model is jw1fsn-dc12v ajw4211. It is a common and widely circulated electromagnetic relay product in the market. How to troubleshoot and deal with the failure of electromagnetic relay? Recently, the innovation test received a batch of fault relays. According to the customer's description, some of these relays did not work during workshop commissioning, and the defect rate was 10%. The appearance of the fault relay is shown in the figure below. It belongs to Panasonic brand and the model is jw1fsn-dc12v ajw4211. It is a common and widely circulated electromagnetic relay product in the market. View >>

Electronic product reliability test specifications and standards recommended by professional testing institutions

Date:2021-07-26 17:06:21

Generally speaking, the test conducted to evaluate and analyze the reliability of electronic products is called reliability test. Through reliability test, the reliability characteristic quantity of electronic products when working or storing under various environmental conditions can be determined, so as to provide useful data for use, production and design; It can also expose the problems existing in the design, raw materials and process flow of the product. View >>

Complete collection of environmental reliability test and inspection standards for electrical and electronic products

Date:2021-07-26 16:10:00

1. Low temperature test environmental test for electrical and electronic products Part 2: Test methods test a: low temperature GB / t2423 1-2008, iec60068-2-1:2007 2. High temperature test environmental test of electrical and electronic products Part 2: Test methods test B: high temperature GB / t2423 2-2008 ,IEC60068-2-2:2007 View >>

The requirements, standards and precautions of high and low temperature alternating damp heat test chamber are introduced in detail

Date:2021-07-26 16:02:00

The operating environmental conditions of high and low temperature alternating damp heat test chamber are as follows: 1. Temperature: 15 ℃ ~ 35 ℃. 2. Relative humidity: no more than 85% RH. 3. There is no strong vibration and strong electromagnetic field nearby. 4. There is no high concentration dust and corrosive substances nearby. 5. There is no direct sunlight or direct radiation from other heat sources. 6. There is no strong airflow nearby. When the nearby air needs forced flow, The air flow shall not be blown directly onto the box. View >>

Low temperature test of electronic products: how long do components usually fail at low temperature?

Date:2021-07-26 13:46:00

Introduction to low temperature test: GB / T 2423.1-2008 / iec60068-2-1:2007 environmental testing of electrical and electronic products Part 2: Test methods test a: low temperature test the low temperature test involved in this standard is applicable to two types of test samples: non heat dissipation and heat dissipation This standard is only used to assess and determine the environmental adaptability of electrical and electronic products (including components, equipment and other products) stored and used under low temperature environmental conditions. View >>

How to do high and low temperature test? Product high and low temperature test standard

Date:2021-07-26 11:35:00

Before leaving the factory, the chip needs environmental test to simulate the adaptability of the chip to operation and storage in the climate environment, so as to ensure that it can work normally in extreme environments. High and low temperature test is a method used to determine the adaptability of products to storage, transportation and use under high temperature climate and environmental conditions. The severity of the test depends on the temperature of the high temperature and the duration of exposure. View >>

What is the high and low temperature test? Standards and methods for high and low temperature test items of electronic products

Date:2021-07-26 11:16:00

High and low temperature test, also known as high and low temperature cycle test, is one of the environmental reliability tests. The purpose of the test is to evaluate the impact of high and low temperature conditions on the performance of equipment during storage and operation. Basically, all products are stored or operated at a certain temperature. View >>

What is electrical performance? What does the electrical performance test include?

Date:2021-07-23 17:41:36

What is electrical performance? Electrical performance describes some electrical parameters, such as rated voltage, current, active power, reactive power, resistance, capacitance, inductance and conductance. There is an internal correlation between structure and properties, in which the aggregated structure is an important factor that directly affects the properties of materials. In the process of partial discharge damage, the heat generated by partial discharge will increase the crystallinity and orientation of oil immersed insulating paper, which will also change its electrical properties. View >>

What measures will be taken to improve the reliability of integrated circuit layout design?

Date:2021-07-23 17:09:29

Integrated circuit layout design refers to mapping the circuit design circuit diagram or circuit description language to the physical description level, so that the designed circuit can be mapped to the wafer for production. Layout is a graph containing relevant physical information such as device type, device size, relative position between devices and connection relationship between devices of integrated circuit. These graphs are composed of graphs located on different drawing layers. Integrated circuit design method involves a wide range and complex content, in which layout design is the basic technology of integrated circuit physical implementation. View >>