Date：2021-11-11 13:40:00

Chip decap, also known as chip unsealing or chip cap opening, is a common detection method for chip failure analysis. Usually, the data book can provide a lot of information about the chip. If you want to design reliable, low-power and high-performance chip products, you can't stay in the data book. You need to deeply study the internal working principle of the integrated circuit, the relationship between its manufacturing process and its performance, and have a certain ability to analyze the integrated circuit. View >>

Date：2021-11-11 11:39:44

Integrated circuits are divided into commercial devices, industrial devices, automotive industrial devices and military devices. The operating temperature range is also different. Commercial grade devices are 0 ~ + 70 ℃, industrial grade devices are - 40 ~ + 85 ℃, automotive industrial grade devices are - 40 ~ + 125 ℃, and military grade devices are - 55 ~ + 155 ℃. Whether the device can be baked can be judged according to the temperature level and baking temperature of the device. View >>

Date：2021-11-10 15:31:41

There are many links involved in PCBA processing and manufacturing process. We must control the quality of each link to produce good products. Generally, PCBA consists of a series of processes, such as PCB circuit board production, component procurement and inspection, SMT patch processing, plug-in processing, program firing, PCBA testing, aging, assembly and so on, Let's focus on analyzing the related problems of function test: View >>

Date：2021-11-10 14:56:03

In SMT processing, because many high-precision PCBA circuit boards have a large number of BGA and IC chips, the internal welding status of the core devices of this package can not be seen directly from the surface after welding. Therefore, SMT processing plant must be equipped with relevant testing equipment. The testing equipment for this kind of welding here is mainly X-ray. View >>

Date：2021-11-09 13:54:46

X-ray testing technology is a mature nondestructive testing method. At present, it is widely used in the fields of material testing (IQC), failure analysis (FA), quality control (QC), quality assurance and reliability (QA / REL), R & D (R & D), etc. It can be used to detect the delamination, crack and other defects (crack, delamination, cavity, etc.) of electronic components, LEDs and metal substrates, judge whether there are defects in the material by detecting the image contrast, determine the shape and size of defects, and determine the orientation of defects. View >>

Date：2021-11-09 13:37:00

PCBA is a system composed of PCB and various electronic components. The main material of PCB is the composite of glass fiber and epoxy resin, which is divided into single panel, double-sided board and multilayer board. In the process of PCBA welding, poor PCBA welding will be caused by the influence of welding data, process, personnel and other factors. Next, we mainly introduce the analysis of poor PCBA performance in welding. View >>

Date：2021-11-08 18:25:01

In the macro sense, CPU is the product crystal with the highest scientific and technological content, the most complex process and the most fine structure. From the micro perspective of everyone, CPU seems to be just a commodity, or the kind that everyone can afford. CPU is mainly composed of a lot of arithmetic units, controllers and registers. What does CPU cover opening mean? CPU cover opening is nothing more than opening the metal cover on the top of the CPU through the CPU cover opener, mainly to replace the silicone grease on the wafer with liquid gold and further improve the heat dissipation performance of the CPU. View >>

Date：2021-11-05 15:00:00

Rapid temperature change test is a kind of environmental test. The rapid temperature change test chamber is used to set a certain temperature change rate for the rapid transition between high temperature and low temperature. It is used to determine the adaptability of products to storage, transportation and use in the climate environment with rapid changes of high temperature and low temperature. The severity of the rapid temperature change test depends on the high / low temperature range, the change time, and the number of cycles. The test process generally takes normal temperature → low temperature → low temperature residence → high temperature → high temperature residence → normal temperature as a test cycle. Verify the change of functional characteristics of the sample after temperature change or continuous temperature change environment, or the operation functionality in this environment. View >>

Date：2021-11-05 14:15:00

In October, the lack of core market continued. According to Susquehanna, a financial institution, the delivery date of chips in October was delayed to 21.9 weeks, reaching a new high. The market situation of short supply prompted many wafer foundries to start a new round of price increases last month, and the impact will continue until next year. View >>

Date：2021-11-05 14:10:00

IP (ingress protection) protection grade system is drafted by IEC (International Electrical Communication), which classifies electrical appliances according to their dust-proof and moisture-proof characteristics. IP protection level is composed of two numbers. The first number represents the level of dust prevention and foreign object intrusion prevention of electrical appliances (foreign objects including tools and human fingers are not allowed to touch the live parts in electrical appliances to avoid electric shock). The second number represents the tightness of electrical appliances against moisture and water immersion. The larger the number, the higher the protection level. The IP protection grade system provides a way to classify products according to the dust-proof, waterproof and anti-collision degree of electrical equipment and packaging View >>