Date：2021-11-18 13:40:24

Semiconductor industry is developing rapidly. Semiconductor packaging is a very important link affecting the development of semiconductor industry. The quality of semiconductor packaging technology is a crucial competitive factor. Whether the electronic components are installed incorrectly or not, whether the connector and battery size are in compliance, etc. The application in the semiconductor industry began very early. Driven by the increasing popularity of large-scale integrated circuits in the semiconductor industry, the demand for output and quality in the industry is increasing sharply. Nowadays, in the field of electronic manufacturing, from capacitors, resistors, connectors and other components to PC boards and hard disks, we can almost see the presence of third-party testing institutions in all links of the electronic manufacturing industry chain. View >>

Date：2021-11-18 13:28:49

Product inspection is an essential means of quality control in the production of modern electronic enterprises. It mainly plays the role of process control, quality control and judging the qualification of products. The product inspection shall implement the "three inspection" system combining self inspection, mutual inspection and full-time inspection. View >>

Date：2021-11-17 14:19:43

The primary screening projects and stress conditions carried out by the component manufacturers are difficult to meet the needs of equipment development. The imported components are usually industrial grade or medium and low-grade products, and even fake and shoddy products, which is difficult to ensure the quality and reliability. The inherent reliability of electronic components depends on the reliability design of products. Therefore, we should try to eliminate the problematic components as much as possible before the electronic components are installed on the whole machine or equipment. Therefore, we should screen the components. So, how to screen components? What are the main items? View >>

Date：2021-11-17 14:12:43

Failure analysis (FA) is a post inspection of failed devices. According to the needs, electrical testing and various advanced physical, metallographic and chemical analysis technologies are adopted, and the analysis is carried out in combination with the specific conditions before and after the failure of components and relevant technical documents, so as to verify the reported failure and determine the failure mode, failure mechanism and causes of components and parts View >>

Date：2021-11-16 13:54:47

With the continuous development of intelligent manufacturing technology, the appearance defect detection of most artificial products can be realized through artificial intelligence technology. Due to the disadvantages of slow detection efficiency and low detection accuracy, the visual detection of surface appearance defects can better replace the traditional detection methods. In the production process of electronic components, complex process treatment is required. Under multiple process treatment, various problems will appear, such as surface defects, unclear characters and so on. Any product will produce some poor appearance during production, and electronic components are no exception. So, how to check the appearance quality of electronic components? What are the contents of appearance defect detection of electronic components? View >>

Date：2021-11-16 13:45:14

Electronic component testing is the application of testing service industry technology in electronic information industry. It is an important link in the specific industrial chain of electronic components. The level of testing service technology is closely related to the quality of electronic components. This is also an essential basic work. How to accurately and effectively detect the relevant parameters of components and judge whether the components are normal is not a stereotype. Different methods must be adopted according to different components to judge whether the components are normal or not. View >>

Date：2021-11-15 16:36:28

The third-party testing organization, also known as fair test, refers to an object other than two interrelated subjects, which we call the third party. The third party is a third party (such as a full-time supervision and inspection organization) outside the interests of the sale and purchase, which carries out commodity inspection activities in accordance with relevant laws, standards or contracts in an impartial and authoritative non party capacity. Third party testing institutions can not lose their conscience because of their interests, otherwise they will be abandoned by consumers. It is precisely because of the special form of third-party testing institutions that emphasize their own independence, transparency and fairness, so third-party testing institutions rarely encounter legal disputes. View >>

Date：2021-11-12 11:26:00

At present, the demand for lead-free soldering in the electronic industry is becoming more and more urgent, which has had a great impact on the whole industry. Lead free solder has begun to gradually replace lead solder, but lead-free technology will inevitably bring new problems to the reliability of solder joints due to the difference of solder and the adjustment of welding process parameters. The failure of a solder joint may cause the failure of the whole device, so how to ensure the quality of solder joint is an important problem. Traditional lead tin solder contains lead, and lead and lead compounds are highly toxic substances. The long-term use of lead solder will bring serious harm to human health and living environment. View >>

Date：2021-11-12 11:15:46

Tape braiding is a process in small capacitors. Before gold spraying, tape the core into a disc with adhesive tape paper, and protect the side of the core, so that the gold spraying will not spray on the side of the core and will not cause short circuit. There is also a finished tape braiding process for small plastic shell capacitors and small plastic encapsulated capacitors, that is, the capacitors are braided one by one onto a paper tape and wound up for packaging and preservation. The equipment used is braiding machine, which is also called braiding packaging machine and winding packaging machine. It is mainly used for packaging SMD materials, led, inductance, resistance and other reel packaging. Braided packaging is a new type of packaging. View >>

Date：2021-11-11 13:40:00

Chip decap, also known as chip unsealing or chip cap opening, is a common detection method for chip failure analysis. Usually, the data book can provide a lot of information about the chip. If you want to design reliable, low-power and high-performance chip products, you can't stay in the data book. You need to deeply study the internal working principle of the integrated circuit, the relationship between its manufacturing process and its performance, and have a certain ability to analyze the integrated circuit. View >>