Date：2021-09-24 16:57:00

Chip unsealing, also known as component cover opening and cap opening, is a commonly used destructive detection method in failure analysis. Make local corrosion for the fully packaged IC, so that the IC can be exposed, keep the chip function intact, and keep die, bond pads, bond wires and even lead - from damage, so as to prepare for the next chip failure analysis experiment, facilitate observation or other tests (such as FIB and Emmi), and the function is normal after decap. So what is Kaifeng? What's the use of Kaifeng for us? How did the third-party laboratory open? Now let's take you to learn more. View >>

Date：2021-09-24 15:47:00

When analyzing the internal chips, wires and components in the chip failure analysis, due to the blocking observation of the packaging colloid, the combination of "laser etching" and "wet etching" is used to open the cover (decap) and remove the glue (compound removal), so as to expose the coated objects in the package for subsequent experimental treatment and observation. Opening the chip is equivalent to performing surgery on the chip. Through opening, we can intuitively observe the internal structure of the chip. After opening, we can judge the current situation and possible causes of the sample in combination with OM analysis. This paper collects and arranges some data related to chip cap opening detection, and hopes that this paper can be of great reference value to all readers. View >>

Date：2021-09-24 14:33:00

IC opening, also known as opening, sealing, capping, decap, decapsulation, IC unsealing adhesive, refers to removing the epoxy resin or other packaging materials on the IC die (die, wafer), exposing the die, and preparing for IC decryption, FIB, photographing or preventing decryption. Normal opening does not damage the function of the master chip. Unsealing and capping is a physical-chemical test, which dissolves the epoxy resin colloid on the outer surface of the chip and retains the complete grain or gold wire, so as to check the important marks, layout, process defects, etc. on the grain surface. View >>

Date：2021-09-24 14:25:00

With the continuous upgrading of artificial intelligence technology, product appearance defect detection can also be realized through artificial intelligence technology. Due to the disadvantages of slow detection efficiency and low detection accuracy in traditional artificial detection, visual detection of surface appearance defects can better replace traditional detection methods. At each node, the feature size of the chip becomes smaller and smaller, and the defects are more difficult to find. Defects are undesirable deviations in the chip, which will affect the yield and performance. The advantages of non-contact, continuity, economy and flexibility of machine vision detection make people have a better choice. Manual detection is gradually replaced by machine vision detection. The application of machine vision detection system to semiconductor detection is mainly through positioning the real-time captured image by pattern matching, analyzing and processing the image and obtaining View >>

Date：2021-09-24 12:00:56

Failure mechanism is a physical or chemical process that leads to the failure of parts, components and materials. The inducing factors of this process are internal and external. When studying the failure mechanism, we usually start with the external inducing factors and failure manifestations, and then study the more hidden internal factors. This is also the reverse thinking and exploration for people to understand the essence and development law of things, the basic link and key to change failure into safety, and the source and way for people to deepen their understanding of objective things. In order to help you have an in-depth understanding, this paper will summarize the component failure analysis and detection methods. If you are interested in what this article will cover, read on. View >>

Date：2021-09-23 16:00:34

Failure analysis is a technology to analyze and study the characteristics and laws of failure phenomena such as fracture, surface damage and deformation of components. It has strong practical significance in improving the quality of components, technical development and improvement, product repair and arbitration of failure accidents. It is an activity to simulate and reproduce the failure phenomenon, find out the causes of component failure and dig out the failure mechanism according to the failure mode and phenomenon through analysis and verification. Methods are divided into destructive analysis, nondestructive analysis, physical analysis, chemical analysis, etc. View >>

Date：2021-09-23 15:54:37

Failure refers to the failure of electronic components. The important components of various electronic systems or electronic circuits are generally different types of components. When it needs more components, it indicates that the complexity of its equipment is higher; On the contrary, it is low. Generally, circuit failure is defined as the loss of specified functions of the circuit system. Failure analysis is the process of obtaining the failure mechanism and cause of electronic products through a series of analysis technical means such as electricity, physics and chemistry. Based on the obtained failure mechanism and causes, targeted improvement measures can be taken to improve the reliability and yield of products, shorten the R & D cycle, build a good brand, solve technical disputes and save costs. View >>

Date：2021-09-23 15:24:41

The purpose of failure analysis of electronic components is to confirm the failure phenomenon of electronic components with the help of various test and analysis technologies and analysis procedures, distinguish their failure mode and failure mechanism, determine the cause of their final failure, put forward suggestions for improving design and manufacturing process, prevent the recurrence of failure and improve the reliability of components. Failure analysis is an important part of product reliability engineering. Failure analysis is widely used to determine the causes of production problems in the development and production process, identify reliability related failures in the test process, and confirm the field failure mechanism in the use process. View >>

Date：2021-09-23 15:22:40

Failure analysis is an important part of product reliability engineering. Failure analysis is widely used to determine the causes of production problems in the process of development and production, identify reliability related failures in the process of testing, and confirm the on-site failure mechanism in the process of use. In the development stage of electronic components, failure analysis can correct errors in design and development and shorten the development cycle; In the production, testing and use stage of electronic components, failure analysis can find out the failure causes of electronic components and the responsible party causing the failure of electronic components. What are the main failure analysis methods? Let's have a look. View >>

Date：2021-09-23 11:46:00

Solderability test refers to the qualitative and quantitative evaluation of the solderability of components, PCB, pad, solder and flux by the principle of wetting balance method. Whether it is an obvious poor welding problem, or a problem that is not easy to detect or will affect the tin loading ability of the product, it can be found through the test and find out the root cause, so as to help the enterprise effectively determine the weldability and product quality after production and assembly. View >>