Date：2021-09-18 15:03:05

Weldability refers to the ability of materials to be welded into components specified by design requirements and meet predetermined service requirements under specified welding conditions. For the metal with good weldability, the welded joint is not easy to produce cracks, pores and slag inclusion defects, and has high mechanical properties. The weldability of metal materials refers to the difficulty of obtaining high-quality welded joints under certain welding methods, welding materials, process parameters and structural types. The main factor of weldability of steel is chemical composition. Among various elements, the influence of carbon is the most obvious, and the influence of other elements can be converted into the influence of carbon. Therefore, the weldability of welded steel can be estimated by carbon equivalent method. Sulfur and phosphorus also have a great impact on the welding performance of steel. In all kinds of qualified steel, sulfur and phosphorus should be strictly limited. View >>

Date：2021-09-18 14:54:59

In recent years, as metal materials are more and more widely used in various fields of production and life, the problem of material failure is becoming more and more prominent. Material failure mainly refers to the mechanical component can not fully complete the predetermined function due to the change of size, shape or material organization and performance. The failure modes of metal materials in various engineering applications are mainly composed of fracture, corrosion, wear and deformation. The scope of metal material testing and analysis involves mechanical performance testing, chemical composition analysis, metallographic analysis, precision dimension measurement, nondestructive testing, corrosion resistance test and environmental simulation test of ferrous metals, non-ferrous metals, mechanical equipment and parts. View >>

Date：2021-09-18 14:50:59

(1) According to the macroscopic deformation before material fracture, the fracture is divided into ductile fracture and brittle fracture. (2) Ductile fracture is an obvious macroscopic plastic deformation before fracture. Brittle fracture is that plastic deformation does not occur before fracture, and its fracture is flush after fracture, which is composed of countless shiny small planes. View >>

Date：2021-09-17 18:12:29

PCBA test is an important part of controlling product quality in PCBA process. In order to ensure the quality of PCBA, it is necessary to carry out corresponding PCBA reliability test, so PCBA reliability test is particularly important. There are many contents of reliability test. Next, I'll give you a brief introduction. View >>

Date：2021-09-17 17:47:20

With the progress of science and technology, intelligent products are increasing day by day. From computers and smart phones to automotive electronics and artificial intelligence, we can see them everywhere in our production and life. The key to their development is the semiconductor chip that drives the internal transceiver. Due to the continuous improvement of product quality and reliability requirements, failure analysis is becoming more and more important. Chip failure analysis can help IC designers find design defects, mismatch of process parameters or improper design and operation. Next, let's look at the chip IC failure analysis test. View >>

Date：2021-09-17 17:45:00

In order to ensure the application quality and safety factor of wiring terminals and prevent the occurrence of redundant common faults, it is proposed to scientifically study and formulate relative selection technical standards according to the technical standards of commodities and carry out purposeful reliability detection to prevent invalid. The terminal line inspection generally involves the following items: plugging force test, durability test, insulation resistance test, vibration test, mechanical impact test, cold and hot impact test, mixed gas corrosion test, etc. View >>

Date：2021-09-16 16:38:00

The connotation of electronic products is very extensive, including not only electronic materials and electronic components, but also installing them in the designated position according to the established assembly process procedures, design assembly drawings and wiring diagrams, according to certain accuracy standards, technical requirements and assembly sequence, and then connecting all parts of the circuit with each other by conducting wires to form a whole with independent performance. SMT packaging technology widely used in electronic packaging, new chip size packaging (CSP), solder ball array (BGA) and other packaging technologies require direct electrical and rigid mechanical connection between different materials through solder joints (mainly bearing shear strain). Production practice has proved that good electrical contact is an important factor to ensure the quality and reliability of electronic products, The failure of electronic products is closely related to the quality of electrical installation. Main text View >>

Date：2021-09-16 16:15:23

PCBA lead-free solder joint reliability test mainly refers to the thermal load test (temperature impact or temperature cycle test) for electronic assembly products; Carry out mechanical stress test on the junction of electronic devices according to the fatigue life test conditions; Use the model for life assessment. As the carrier of various components and the hub of circuit signal transmission, PCBA has become the most important and key part of electronic information products. Its quality and reliability level determine the quality and reliability of the whole equipment. In order to verify the reliability of PCBA lead-free solder joints in the actual working environment, it is necessary to test the reliability of PCBA lead-free solder joints. View >>

Date：2021-09-16 16:08:00

How can X-ray detection technology be better applied to PCBA? First, let's understand the development of PCBA industry. With the development of high-density packaging technology, testing technology is also facing new challenges. Many new technologies are also emerging to meet new challenges. X-ray detection technology is a very important method. Through X-ray detection, the welding and assembly quality of BGA can be effectively controlled. At present, X-ray detection system is not only used for laboratory analysis, but also used in many production industries. PCBA industry is one of them. X-ray detection technology is a necessary means to ensure the quality of electronic assembly to some extent. View >>

Date：2021-09-16 15:32:07

The purpose of chip testing is to eliminate failure and potential failure chips in the process of design and production and prevent defective products from flowing into customers. Therefore, we need to increase the evaluation of chip test level when selecting the type. Through the communication with the original factory and the sealing and testing factory, we can obtain the key parameters and indicators in the stage of chip design verification → process inspection → wafer test → chip finished product test for comprehensive evaluation. View >>