Date：2021-09-23 11:42:19

Surface assembled components, also known as sheet element devices, are divided into surface assembled components and surface assembled devices, which are recorded as SMC or SMD. They are micro electronic components without leads or with short leads, which are suitable for surface installation. With the rapid development of surface assembly technology and chip components, the type and quantity of chip components have increased significantly and become the mainstream products of electronic components. The main inspection items of SMT SMT surface assembly components incoming inspection include weldability, solder resistance, pin coplanarity and usability. There are two methods for weldability: wetting test and immersion test. View >>

Date：2021-09-22 16:30:16

In electronic manufacturing, the connection of components needs to be welded. The quality of welding has a great impact on the quality of manufacturing. The welding of electronic components is divided into three categories: fusion welding, pressure welding and brazing. Now commonly used tin welding belongs to soft soldering in brazing (the melting point of solder is lower than 450 ℃), which is called tin welding because lead tin solder is used for welding. Fusion welding and pressure welding are generally used for high-power electronic components and equipment with special requirements. Welding is a very important link in the maintenance of electronic products. After the fault of electronic products is detected, welding is followed. View >>

Date：2021-09-22 16:24:00

The process flow of PCBA patch processing is very complex, including PCB manufacturing process, component procurement and inspection, SMT patch assembly, dip plug-in, PCBA testing and other important processes. PCBA function test refers to a test method that provides a simulated running environment (excitation and load) for the test target board to make it work in various design states, so as to obtain the parameters of each state to verify the function of PCBA. Simply put, it is to load appropriate excitation on PCBA and measure whether the output response meets the requirements. It generally refers to PCBA function test after PCBA is powered on. View >>

Date：2021-09-22 15:14:08

There are many methods of electronic testing. Among them, solderability test refers to the qualitative and quantitative evaluation of the solderability of components, PCB, pad, solder and flux through the principle of wetting balance method. It is of great help to the level 1 (IC packaging) and level 2 (electronic components assembled to printed circuit board) processes of modern electronic industry, which need high-quality interconnection technology and high-quality and zero defect welding process. Solderability of components refers to their ability to be welded within a specified time and at a specified temperature. It is related to the thermal characteristics, wettability and heat resistance of components. For example, optical fiber socket is difficult to weld by hand because of its large heat capacity. Let's take a look at the solderability test methods and tools of electronic components View >>

Date：2021-09-22 15:10:45

In the international standard classification, the solderability test center involves non-ferrous metals, metal material tests, printed circuits and printed circuit boards, environmental tests, electrical and electronic tests, welding, brazing and low-temperature welding, integration of electronic components, electronic component components, fasteners for aerospace manufacturing, and electrical equipment and systems for aerospace. In the Chinese standard classification, the solderability test center involves precious metals and their alloys, metal process performance test methods, printed circuits, welding and cutting, environmental conditions and general test methods, reliability and maintainability, basic standards and general methods, and connectors. View >>

Date：2021-09-22 11:40:00

As we all know, the production of electronic products needs to take into account both software and hardware. In short, the integration of operating system and hardware is a knowledge. After consumers obtain an electronic product, the appearance and use experience can get feedback at the first time. Even if the separate hardware or operating system can confuse the real with the false, there is still a considerable threshold for the integration of the two. If the integration is not good enough, it will directly affect the use experience of consumers. At present, there is a lack of core market, a large area of supply chain is in an unbalanced state, and a variety of components are in shortage. China has almost the world's largest electronic component Trading Distribution Center, where there are large and small businesses that disassemble tens of thousands of e-waste every day. All these provide market opportunities for fake chips. Most of them are circulated at home, and some are also circulated to overseas supply chains. View >>

Date：2021-09-18 17:55:29

The failure analysis of metal materials focuses on the phenomenon that the mechanical or mechanical parts and components can not better complete the specified function or the mechanical components lose the original design function due to the change of size, shape, material performance or structure during the use of structural parts (or in the test process before use). So as to find out the main causes of structural member failure, as well as failure prevention measures and product improvement scheme tips. View >>

Date：2021-09-18 17:45:44

With the continuous innovation of chip technology and chip packaging technology, the chip area and packaging area are developing towards smaller, lighter and thinner, the number of pins is increasing, the pin spacing is decreasing, and the difficulty of chip appearance detection is also increasing. The traditional manual detection method has been difficult to meet the high requirements of detection and can not adapt to mass production. Machine vision detection system is widely used in various fields, from medical images to remote sensing images, from industrial production detection to file processing, from nano technology to multimedia database, almost all occasions that need human vision need machine vision detection system, especially in some fields that require high or cannot be perceived by human vision, such as accurate quantitative perception The role of machine vision detection system is particularly important for the perception of dangerous scene and invisible objects View >>

Date：2021-09-18 17:42:00

With the continuous development of electronic technology, SMT technology is becoming more and more popular, the volume of single chip microcomputer chip is becoming smaller and smaller, and the foot position of single chip microcomputer chip is also gradually increasing, especially BGA single chip microcomputer chip appeared in recent years. Because the BGA single chip microcomputer chip is not distributed according to the traditional design, but distributed at the bottom of the single chip microcomputer chip. According to the traditional artificial vision detection, it is undoubtedly impossible to judge the quality of the solder joint, so it must be tested according to ICT and even function. However, if there are batch errors, they cannot be found and corrected in time. Artificial vision detection is the most inaccurate and reproducible technology. Therefore, X-ray detection technology is widely used in SMT post reflow detection. It can not only qualitatively analyze the solder joint, but also find and correct the fault in time. View >>

Date：2021-09-18 15:30:42

The failure form of metal materials is closely related to the failure cause. The failure form is the apparent characteristic of the material failure process, which can be observed in a proper way. The failure reason is the physical and chemical mechanism leading to component failure, which needs to be diagnosed and demonstrated through the investigation and research of failure process and the macro and micro analysis of failed parts. This paper collects and arranges some relevant data of metal material testing, hoping that this paper can be of great reference value to all readers. View >>