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SERVICE
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IC Counterfeit Test
IC(Integrated Circuit) refers to a chip made of a large number of microelectronic components (such as transistors, resistors, capacitors, diodes, etc.) Integrated Integrated circuits on a plastic substrate. The concept of IC chip broadly speaking, is the semiconductor components products collectively.
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Electrical and Temperature Testing
Key function testing is also called main function testing. Refers to various necessary logic or signal state tests carried out under specific working conditions (i.e. the normal operating environment of the device, usually at room temperature) and the normal working state of the device. This test according to the original factory specifications and industry standards or specifications, design feasibility test vector or special test circuit, exert the corresponding signal input on test samples, through regulation and control of the peripheral circuit, signal amplification or conversion matching specific criteria, such as analysis of the logical relation and the change of the output waveform signal status, the features of detection device.
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Failure analysis
Through professional failure analysis equipment, with the help of a variety of test analysis technology and analysis procedures to identify the failure of electronic components, identify the failure mode and failure mechanism, confirm the final cause of failure, and put forward suggestions to improve the design and manufacturing process, to prevent the recurrence of failure.
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Rohs test
According to the EU standard requirements, the product split into a single material is uniform material after testing, including lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyl (PBB), polybrominated diphenyl ether (PBDE) and other six kinds of harmful substances are in line with the RoHS directive requirements, the maximum order standard: cadmium: 0.01% (100PPM); Lead, mercury, hexavalent chromium, polybrominated biphenyl (PBB), polybrominated diphenyl ether (PBDE)0.01% (1000PM)
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External Visual
InspectionAppearance testing refers to confirming the number of chips received, inner packaging, humidity indication, desiccant requirements and appropriate outer packaging. Secondly, the appearance of a single chip is tested, mainly including the typing, year, country of origin, whether the chip is re-coated, the state of the pins, whether there are re-polished marks, unknown residues, and the location of the manufacturer's logo.
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Acetone Test
Acetone test is to wipe the screen print on the front surface of the chip regularly with a certain concentration of acetone, and the result is used to judge whether the chip surface is reprinted.
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X-Ray Inspection
X-Ray testing is a real-time non-destructive analysis to examine the hardware components inside the component. It mainly checks the chip pin frame, wafer size, gold wire binding pattern, ESD damage and holes. Customers can provide good products for comparison inspection.
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CASES
ADVANTAGES
Excellent Technical Team
Standard Management System
Rich Testing Experience
NEWS
Downstream Innovation, Upstream Transformation: How the AI Hardware Wave Reshaps the Component Supply Chain
At the beginning of 2026, as global attention focused on CES in Las Vegas, an exhibition in Shenzhen, China that may be closer to the pulse of industry landing was held simultaneously. The Alibaba Cloud Tongyi Intelligent Hardware Exhibition brings together thousands of AI hardware in various forms, from subtle emotional companion robots to massive intelligent processing centers. Together, they outline a clear future vision: artificial intelligence is entering the physical world within our reach at an unprecedented scale and speed, from cloud based data centers. This terminal explosion wave, driven by the concept of "big models defining hardware," is conveying a clear and structural upgrade demand to the upstream electronic components industry.
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