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IC Counterfeit Test
IC(Integrated Circuit) refers to a chip made of a large number of microelectronic components (such as transistors, resistors, capacitors, diodes, etc.) Integrated Integrated circuits on a plastic substrate. The concept of IC chip broadly speaking, is the semiconductor components products collectively.
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Electrical and Temperature Testing
Key function testing is also called main function testing. Refers to various necessary logic or signal state tests carried out under specific working conditions (i.e. the normal operating environment of the device, usually at room temperature) and the normal working state of the device. This test according to the original factory specifications and industry standards or specifications, design feasibility test vector or special test circuit, exert the corresponding signal input on test samples, through regulation and control of the peripheral circuit, signal amplification or conversion matching specific criteria, such as analysis of the logical relation and the change of the output waveform signal status, the features of detection device.
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Failure analysis
Through professional failure analysis equipment, with the help of a variety of test analysis technology and analysis procedures to identify the failure of electronic components, identify the failure mode and failure mechanism, confirm the final cause of failure, and put forward suggestions to improve the design and manufacturing process, to prevent the recurrence of failure.
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Rohs test
According to the EU standard requirements, the product split into a single material is uniform material after testing, including lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyl (PBB), polybrominated diphenyl ether (PBDE) and other six kinds of harmful substances are in line with the RoHS directive requirements, the maximum order standard: cadmium: 0.01% (100PPM); Lead, mercury, hexavalent chromium, polybrominated biphenyl (PBB), polybrominated diphenyl ether (PBDE)0.01% (1000PM)
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External Visual
InspectionAppearance testing refers to confirming the number of chips received, inner packaging, humidity indication, desiccant requirements and appropriate outer packaging. Secondly, the appearance of a single chip is tested, mainly including the typing, year, country of origin, whether the chip is re-coated, the state of the pins, whether there are re-polished marks, unknown residues, and the location of the manufacturer's logo.
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Acetone Test
Acetone test is to wipe the screen print on the front surface of the chip regularly with a certain concentration of acetone, and the result is used to judge whether the chip surface is reprinted.
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X-Ray Inspection
X-Ray testing is a real-time non-destructive analysis to examine the hardware components inside the component. It mainly checks the chip pin frame, wafer size, gold wire binding pattern, ESD damage and holes. Customers can provide good products for comparison inspection.
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NEWS
Wafer fab cleanroom: the micro guardian of semiconductor manufacturing
In the precision world of semiconductor components and microfabrication, every tiny dust particle can become a key factor affecting product quality. Therefore, the clean room in the wafer fab has become an important facility to ensure the smooth progress of the semiconductor manufacturing process.
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