SERVICE
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IC Counterfeit Detection
- IC Counterfeit Detection-Introduce
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Non-Destructive Testing (NDT)
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Destructive Testing
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Value-Added Services
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Destructive Physical Analysis (DPA)
- Destructive Physical Analysis (DPA)-Introduce
- External Visual Inspection
- X-Ray inspection
- Functional Testing (FT)
- Particle Impact Noise Detection (PIND/PIN-D)
- Hermeticity
- Internal Water Vapor
- Scanning Acoustic Tomography (SAT Testing)
- Solderability Test
- Decapsulation/Delid Test
- Bond Strength
- Die Shear Strength
- Configuration
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Failure analysis
- Failure analysis-Introduce
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Non-Destructive Analysis
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Electrical Testing
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Fault Location
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Destructive Physical Analysis (DPA)
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Physical Analysis
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Engineering Sample (ES) Packaging Service
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Competitor Analysis
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Development and Functional Verification
- Development and Functional Verification-Introduce
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New Product Development Testing (FT)
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Key Functional Testing
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Materials Analysis
- Materials Analysis-Introduce
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FIB Circuit Edit
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Structural Observation
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Compositional Analysis
- EDS Analysis
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Reliability Testing
- Reliability Testing-Introduce
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Reliability Verification of Automotive Integrated Circuits (ICs)
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Environmental Testing
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Mechanical Testing
- Pull Test
- Die Strength Test
- High Strain Rate Test - Vibration Test
- Low Strain Rate Test - Bending Test
- High Strain Rate Test - Mechanical Shock Test
- Package Assembly Integrity Test - Wire Bonding Integrity
- Package Assembly Integrity Test
- Combined Vibration/Temperature/Humidity Test
- Combined Temperature/Humidity/Vibration/Altitude Test
- Free Fall Drop Test
- Box Compressive Strength Test
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Corrosion Testing
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IP Waterproof/Dust Resistant Test
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Electromagnetic Compatibility (EMC)
- Electromagnetic Compatibility (EMC)-Introduce
- Immunity to Conducted Disturbances, Induced by Radio Frequency (RF) Fields
- Conducted Immunity Test
- Specific Absorption Rate (SAR) Testing for Electromagnetic Radiation
- Electrical Fast Transient/Burst (EFT/B) Test
- Voltage Flicker/Fluctuation Test
- Voltage Dips, Short Interruptions and Voltage Variations Immunity Test
- Power Frequency Magnetic Field (PFMF) Immunity Test
- Harmonic Interference Test
- Electrostatic Discharge (ESD) Immunity Test
- Surge/Lightning Immunity Test
- Radiated Emissions (RE) Test
- Radio Frequency (RF) Test
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Chemical Analysis
- Chemical Analysis-Introduce
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High-Performance Liquid Chromatography (HPLC)
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Pyrolysis-Gas Chromatography-Mass Spectrometry (PY-GC-MS)
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Inductively Coupled Plasma Optical Emission Spectroscopy (ICP-OES)
- Flame Retardancy Test
关键功能测试(Function Testing)
描述:关键功能测试又称为主要功能检测。指在特定工作条件(即器件正常使用环境,通常为常温),器件正常工作的状态下,进行各种必要的逻辑或信号状态测试。此测试依据原厂规格书以及行业标准或规范,设计可行性测试向量或专用测试电路,对检测样片施加相应的信号源输入,通过外围电路的调节控制、信号放大或转换匹配等特定条件,分析信号的逻辑关系及输出波形的变化状态,检测器件的功能特性。
应用范围:所有半导体器件的关键功能验证。
关键功能测试设备图片:
关键功能测试设备图片: