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Decapsulation/Delid Test


Chip open cap, also known as open cap or open cap, refers to the process of localized corrosion on a fully packaged IC, allowing the IC to be exposed while maintaining the integrity of the chip's functionality and preventing damage to the die, bond pads, bond wires, and even the lead frame. It prepares for the next step of chip failure analysis and facilitates observation or other testing (such as FIB and EMMI), and ensures normal functionality after opening the cap.

Service scope:

Chip unsealing, epoxy resin removal, IGBT silicone removal, sample thinning

Images of Decapsulation Test:

Image of Solderability Testing Equipment:

Scope of opening (unsealing):

Ordinary packaging includes COB, BGA, QFP, QFN, SOT, TO, DIP, BGA, COB ceramics, metals, and other special packaging. Generally, there are chemical opening, mechanical opening, and laser opening.

The Decap laboratory can handle almost all IC packaging forms (COB, QFP, DIP, SOT, etc.) and wire types (AuCuAg).

Advantages of laboratory testing:

Failure analysis and capping come from experienced engineers in the field of microelectronics. Through debugging different drugs, they can unlock various products faster and better preserve the integrity of the structure.